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DATE & TIME: Sunday, August 10, 2003 Registration: 8:30 - 9:00 AM Class: 9:00 AM - 5:00 PM |
COST: |
| Photonics Packaging Week at WESCON -- August 10 - 14, 2003 | ||||
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| Sunday August 10 |
Monday August 11 |
Tuesday August 12 |
Wednesday August 13 |
Thursday August 14 |
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PhoPack Short Courses: Full-day Course: "Photonics Packaging: Assy & Test" or AM Course: "Photonic Device Accel Life Testing" and PM Course: "Modeling/Sim for Photonics Pkgng" |
PhoPack Sessions (Day 1) |
PhoPack Sessions (Day 2) |
PhoMat Short Courses: AM Courses (choose one): "Photonics Devices: Mtls, Dsgn and Rel" "Emerging Tech for Opto Pkgng/Assy" "Adhesively Bonded Joints in Opto" PM Courses (choose one): "Designing MEMS for Reliability" "Interface Adhesion & Fracture in Electr Pkgng" "Fiber-Optics Structures: Design for Rel" |
PhoMat Sessions |
| Register for both PhoPack and PhoMat -- take advantage of the joint-registration discount | ||||
| Free admission to all the WESCON exhibits -- included in your Symposium or Short Course registration! | ||||
OUTLINE:
Many of the manufacturing processes used in the assembly and test of fiber-optic or "photonic" components are "borrowed" from the electronics industry; however there are other critical and unique requirements for micro-optical assembly and testing that are particular to photonics devices.
This workshop will focus on the key packaging assembly and test processes, covering critical process parameters, yield issues, manufacturing and test equipment, design guidelines and validation strategies, and cost models. Examples of different types of packages, including coaxial, butterfly, mini-DIL, and planar waveguide packages, will be used in case studies to compare various assembly methods and their costs. Test methods will be discussed with respect to their suitability for different stages of assembly.
WHO SHOULD ATTEND:
This course is appropriate for design, process and manufacturing engineers, or production management in optical component manufacturing companies or contract manufacturers.
OUTLINE:
ABOUT THE INSTRUCTORS:
Randy Heyler is the Vice President, Business Development, for the Advanced Packaging and Automation Systems Division of Newport Corporation. Mr. Heyler has spent over 12 years with Newport Corporation, and was a founder and Vice President of the Photonics Packaging and Advanced Automation Division, which pioneered the first commercial optical assembly automation solutions for the fiber optic component industry. Prior to Newport, Mr. Heyler spent 10 years with Spectra-Physics, Inc. in product development, operations, and marketing management assignments related to scientific and industrial laser systems.
Mr. Heyler holds a BS degree in Mechanical Engineering, and an MS degree in Engineering Management, both from Stanford University. He is a past-president of LEOMA, the Laser and Electro-Optics Manufacturers' Association, past Chairman of the Coalition for Photonics and Optics (CPO), and is currently serving as the Chairman of the Photonics Manufacturer's Association, a new trade association council for the fiber-optics and photonics industry, recently formed as part of the IPC-Association Connecting Electronics Industries. Other industry and technical activities include serving as General Chair for the IEEE/LEOS Opto-Electronics Packaging (OEP2000)Workshop, Chairman of the Semicon West 2001 Symposium on Photonics Device Packaging, Chairman of the SPIE Photonics West 2002 Manufacturing and Automation Forum, Member ECTC Optoelectronics Technical Program Committee, and Technical Chair or committee member for various technical conferences in the area of optoelectronics device packaging and integration. Mr. Heyler is a member of SPIE, IEEE/LEOS, and IMAPS. He has been an invited speaker at numerous industry conferences, holds several patents, and has authored numerous articles and papers in the area of photonics automation and packaging.
Stefan Loeffler is a marketing program manager for Agilent Technologies' Optical Communication Measurement Division. Mr. Loeffler is covering Generic and Advanced Test and Measurement Solutions for passive optical components.
Mr. Loeffler has a 12-year history with Hewlett-Packard and Agilent Technologies, starting as a metrology engineer in the Standards Laboratory, and continuing in a number of sales and marketing positions. Before taking up his present position Mr. Loeffler was the product manager responsible for the product definition and market launch of Agilent's Tunable Laser Sources and then program manager for Photonic Response Systems and Generic Solutions for the test of optical components. Stefan Loeffler holds a Diploma in Electronics Engineering from the University of Stuttgart. Mr. Loeffler presented on Agilent's Lightwave Symposia and is a spokesperson for Agilent.
TO REGISTER:
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Paul Wesling.