An IEEE Professional Development Course in San Francisco
"Fiber-Optics Structures: Design for Reliability"
with Dr. Ephriam Suhir, University of Illinois at Chicago and ERS Co.
DATE & TIME:
Wednesday, August 13, 2003
Registration: 1:00 - 1:30 PM
Class: 1:30 - 5:00 PM
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COST:
IEEE Members: $150; Non-Members: $175
$50 discount when registering for an AM and a PM course
Includes class handouts and refreshments
You can also register for a PM Course
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LOCATION:
Moscone Convention Center, San Francisco
in association with PhoPack and PhoMat --
held jointly with the IEEE WESCON Exhibition.
OUTLINE:
In this course we determine the role of materials, structural attributes and loading conditions on the mechanical behavior and reliability of optical fiber interconnects, whether bare, polymer coated or metallized. The emphasis is on the predictive modeling and the analytical ("mathematical"), rather than numerical (FEA) approach.
WHO SHOULD ATTEND:
Engineers and technical managers that encounter and have to solve various materials, mechanical and reliability problems in fiber optics engineering. Prior knowledge of stress-strain analysis and the elementary theory of bending of beams is desirable, but not required.
LEARNING OBJECTIVES:
The course should enable you to:
- Use easy-to-apply formulas that consider the impact of the major materials and geometric factors on the state of stress and strain in, and the reliability of, optical silica fibers;
- Choose the appropriate material(s) for a particular design and decide how to change, if necessary, the geometrical characteristics of the design to create a viable and reliable fiber optic structure;
- Evaluate stresses and displacements (curvatures) in bare fibers, subjected to bending or to combined action of bending and tension, with consideration, if necessary, of the nonlinear stress-strain relationship of the silica material;
- Analyze the mechanical behavior of polymer coated or metallized fibers, experiencing tension, bending, or the combined action of bending and axial loading, as well as the interfacial strength and strippability of polymer coated fibers;
- Evaluate and prevent thermal stress-strain failures in fiber optics structures (examples include: bow-free assemblies and optical fibers soldered into ferrules), and to explain and evaluate the interaction of the "global" and "local" thermally induced stresses in optical glass fibers adhesively bonded or soldered at the ends into ferrules or capillaries;
- Compute and analyze the elastic stability and microbending of optical fibers (low temperature microbending of long haul optical fibers, buckling of bare, polymer coated or metallized optical fiber interconnects with or without lateral and/or angular misalignments of their ends, etc.);
- Predict the dynamic response of fiber optic structures to shocks and vibrations, applied to their "supports";
- Get an insight into, and explain the role, attributes, challenges, and pitfalls of, the accelerated life testing of photonics systems and its interaction with the qualification (Telcordia) and product-development testing.
ABOUT THE INSTRUCTOR:
Dr. Ephraim Suhir, Distinguished Member of Technical Staff, Bell Laboratories, Basic Research, Physical Sciences and Engineering research Division (retired); Editor of the ASME Journal of Electronic Packaging; Fellow of the ASME, IEEE and SPE. Author of many technical publications (books, book chapters, articles, patents) in the field of microelectronic and photonic packaging and reliability engineering. Recipient of numerous professional awards, including:
2001 IMAPS John A. Wagnon Technical Achievement Award for outstanding contributions to the technical knowledge of the microelectronics, optoelectronics, and packaging industry;
2000 IEEE-CPMT Outstanding Sustained Technical Contribution Award;
2000 SPE International Engineering/Technology (Fred O. Conley) Award for outstanding pioneering and continuing contributions to plastics engineering;
1999 ASME and Pi Tau Sigma Charles Russ Richards Memorial Award for outstanding contributions to mechanical engineering.
TO REGISTER:
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Paul Wesling.