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DATE & TIME: Sunday, August 10, 2003 Registration: 8:30 - 9:00 AM Class: 9:00 AM - Noon |
COST: (and lunch, for those in both AM and PM sessions) |
| Photonics Packaging Week at WESCON -- August 10 - 14, 2003 | ||||
|---|---|---|---|---|
| Sunday August 10 |
Monday August 11 |
Tuesday August 12 |
Wednesday August 13 |
Thursday August 14 |
| PhoPack Short Courses: Full-day Course: "Photonics Packaging: Assy & Test"
AM Course:
"Photonic Device Accel Life Testing" |
PhoPack Sessions (Day 1) |
PhoPack Sessions (Day 2) |
PhoMat Short Courses: AM Courses (choose one): "Photonics Devices: Mtls, Dsgn and Rel" "Emerging Tech for Opto Pkgng/Assy" "Adhesively Bonded Joints in Opto" PM Courses (choose one): "Designing MEMS for Reliability" "Interface Adhesion & Fracture in Electr Pkgng" "Fiber-Optics Structures: Design for Rel" |
PhoMat Sessions |
| Register for both PhoPack and PhoMat -- take advantage of the joint-registration discount | ||||
| Free admission to all the WESCON exhibits -- included in your Symposium or Short Course registration! | ||||
OUTLINE:
This course describes various aspects of accelerated life testing (ALT) and highly accelerated life testing (HALT) in photonic engineering: their role, objectives, attributes, challenges, methodologies, and pitfalls. It addresses both technical and business related aspects of the ALT and HALT, as well as their interaction with qualification testing and product development testing. Particular attention is dedicated to the ALT/HALT models, both analytical and computer-aided. The case of a solder assembly is used to illustrate the discussed concepts and approaches.
WHO SHOULD ATTEND:
The course is intended for engineers, researchers, technical managers, as well as for business and market oriented specialists. No special background is required to comprehend the course content.
OUTLINE:
ABOUT THE INSTRUCTOR:
Dr. Ephraim Suhir is Distinguished Member of Technical Staff (ret.), Bell Laboratories, Basic Research Area, Physical Sciences and Engineering Research Division. He is currently with the University of Illinois, Chicago, IL. Dr. Suhir is Fellow of the American Physical Society (APS), Institute of Electrical and Electronics Engineers (IEEE), American Society of Mechanical Engineers (ASME) and the SPE (Society of Plastics Engineers). He is co-founder and technical editor of the ASME Journal of Electronic Packaging. Dr. Suhir has authored numerous technical publications (papers, book chapters, books, patents), including monographs "Structural Analysis of Microelectronic and Fiber Optic Systems", Van-Nostrand, 1991 and "Applied Probability for Engineers and Scientists", McGraw-Hill, 1997. Dr. Suhir is member of the IEEE Technical Advisory Board (TAB), Distinguished Lecturer of the IEEE CPMT (Components, Packaging and Manufacturing Technologies) Society and Member of the Board of Governors of this Society. He is also Member-at-Large of the IEEE Technical Advisory Board. Dr. Suhir received many distinguished service and professional awards, including: 2001 IMAPS John A. Wagnon Technical Achievement Award, 2000 IEEE Outstanding Sustained Technical Contribution Award, 2000 SPE Fred O. Conley Award, and 1999 ASME and Pi-Tau-Sigma Charles Russ Richards Memorial Award. Dr. Suhir presented numerous invited and keynote talks in universities and at professional conferences worldwide, and taught many professional development and university courses on various topics of materials, reliability and mechanical problems in micro-, opto-electronics and other areas of engineering and applied science.
TO REGISTER:
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Paul Wesling.