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DATE & TIME: Sunday, August 10, 2003 Registration: 1:00 PM - 1:30 PM Class: 1:30 - 5:00 PM |
COST: (and lunch, for those in both AM and PM sessions) |
| Photonics Packaging Week at WESCON -- August 10 - 14, 2003 | ||||
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| Sunday August 10 |
Monday August 11 |
Tuesday August 12 |
Wednesday August 13 |
Thursday August 14 |
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PhoPack Short Courses: Full-day Course: "Photonics Packaging: Assy & Test" or AM Course: "Photonic Device Accel Life Testing" and PM Course: "Modeling/Sim for Photonics Pkgng" |
PhoPack Sessions (Day 1) |
PhoPack Sessions (Day 2) |
PhoMat Short Courses: AM Courses (choose one): "Photonics Devices: Mtls, Dsgn and Rel" "Emerging Tech for Opto Pkgng/Assy" "Adhesively Bonded Joints in Opto" PM Courses (choose one): "Designing MEMS for Reliability" "Interface Adhesion & Fracture in Electr Pkgng" "Fiber-Optics Structures: Design for Rel" |
PhoMat Sessions |
| Register for both PhoPack and PhoMat -- take advantage of the joint-registration discount | ||||
| Free admission to all the WESCON exhibits -- included in your Symposium or Short Course registration! | ||||
OUTLINE:
The main objective of packaging of hotonics devices is to provide a high level of reliability and stability in the performance of the device. Any photonics device should survive a variety of external and internal loadings. Stress analysis, thermo-mechanical modeling, opto-mechanical performance modeling, and convective heat transfer modeling are some of the examples of available simulation tools used in the development of packaging for photonics devices. This course introduces participants to several software tools for investigating the material behavior, parts and assemblies performance, normal and abnormal behavior of the whole device, and other properties.
WHO SHOULD ATTEND:
The course is intended for engineers, researchers, technical managers, as well as for business and market oriented specialists. No special background is required to comprehend the course content.
LEARNING OBJECTIVES:
ABOUT THE INSTRUCTORS:
Dr. E.S. Alber received his PhD degree from the University of Pennsylvania in Mechanical Engineering and Applied Mechanics. His professional career started at Sandia National Laboratories where Dr. Alber worked on computational aspects of materials reliability. He also worked at and consulted (through Alber Technologies, Inc.,) a variety of San Francisco Bay Area start-up companies ( SDL, MEMS - Inlight Communications, ONIX Microsystems, etc.)
Dr. Alber presented numerous invited seminar talks in universities and at professional conferences worldwide.
He is a licensed Professional Engineer in the State of California as an Electrical as well as Mechanical Engineer, and is currently with the Nellcor - Puritan - Bennett (Tyco/Healthcare), Pleasanton, CA.
Dr. Metin Ozen received a BS Mechanical Engineering and MS Applied Mechanics degrees from Lehigh University and a PhD from University of Connecticut in Applied Mechanics. Metin brings with him almost 20 years of experience in Applied Mechanics. He has provided key technical support, training, and consulting work for ANSYS software in the Bay area. He has taught classes throughout the country on topics such as MEMS, Fracture Mechanics and Fatigue, Ball Grid Arrays (BGA's), Heat Transfer, Dynamics, CFD using Flotran, Electromagnetics, and Finite Element Methods. In 2001-2002, Dr. Ozen served as the Chair of the Silicon Valley chapter of ASME. He is an ASME Fellow. Metin Ozen is currently the Director of West Coast Branch for CFD Research Corporation (CFDRC) in Sunnyvale, California. He is responsible for West Coast operations of CFDRC; sales, marketing, managing, training, and consulting. He has been with CFDRC since January 2001.
TO REGISTER:
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Paul Wesling.