An IEEE Professional Development Course in San Francisco

"Photonics Devices: Materials, Physical Design and Reliability"
with Dr. Torsten Wipiejewski, STRI, Kowloon, Hong Kong

Photonics Packaging Week at WESCON -- August 10 - 14, 2003
Sunday August 10	Monday August 11	Tuesday August 12	Wednesday August 13	Thursday August 14
PhoPack Short Courses: Full-day Course:     "Photonics Packaging: Assy & Test" or AM Course:     "Photonic Device Accel Life Testing" and PM Course:     "Modeling/Sim for Photonics Pkgng"	PhoPack Sessions (Day 1)	PhoPack Sessions (Day 2)	PhoMat Short Courses: AM Course:    "Adhesively Bonded Joints in Opto" PM Courses (choose one):     "Interface Adhesion & Fracture in Electr Pkgng"     "Fiber-Optics Structures: Design for Rel"	PhoMat Sessions
Register for both PhoPack and PhoMat -- take advantage of the joint-registration discount
Free admission to all the WESCON exhibits -- included in your Symposium or Short Course registration!

OVERVIEW:
Photonic devices play an essential role in optical communication systems. Edge emitting laser diodes and vertical-cavity surface-emitting lasers (VCSELs) are the light sources on the transmitter side. Pin- MSM-, or avalanche-photodiodes receive the optical signals. External modulators are preferred over direct modulation for long-haul, high speed systems. Laser diodes are in general the highest stressed devices in optical systems. This course will explain the reliability requirements and test methods for photonic devices with special focus on laser diodes. We will discuss how material selection and device design impact laser reliability. The enhanced laser current and photon density for very high data rates require an even more careful laser design to meet performance and reliability targets at the same time.

WHO SHOULD ATTEND:
Engineers and technical managers who want to enhance their knowledge of photonic devices in optical communication systems and their reliability. The course targets people involved in photonic device design and fabrication as well as optical system level work and material science.

OUTLINE: Photonic devices for optical communication Edge emitting lasers VCSELs High speed modulators Photodetectors (pin, MSM, avalanche) Reliability requirements for laser diodes Accelerated aging Temperature cycling Damp heat Mechanical shock and vibration

Reliability evaluation Statistical analysis Failure rate prediction Design constraints for laser diodes Edge emitting lasers 10Gb/s VCSELs Long wavelength VCSELs Material selection Failure analysis Chip level methods Package evalulation Summary and outlook

ABOUT THE INSTRUCTOR:
Torsten Wipiejewski is currently VP of Photonic Applications at ASTRI in Hong Kong specializing in optoelectronic packaging. Before joining ASTRI in 2003, Torsten Wipiejewski was Director of Advanced Technology and Program Manager at Agility Communications in Santa Barbara, California. In this role he managed the new-product-introduction of two tunable laser products from initial R&D stage to Telcordia qualification and production ramp-up. Until 2000 he was the general manager of the Optoelectronic Components Group of Infineon Fiber Optics in Munich, Germany. He joined Siemens Fiber Optics (now Infineon) in 1996 and worked as VCSEL project manager at different locations in Germany. Following his Ph.D. project he worked on novel vertical-cavity lasers during a two-year post-doctoral stay at the University of California at Santa Barbara and at the University of Ulm as manager for a joint European Union project. He received a summa cum laude Ph.D. degree for his work on vertical-cavity surface-emitting lasers (VCSELs) from the University of Ulm, Germany in 1994 and a M.Sc. degree in Electrical Engineering from the Technical University of Braunschweig in 1990.

Dr. Wipiejewski is the Co-Chair of the ECTC Optoelectronics program committee and program committee member of SPIE Photonics West and EPTC. He is a member of IEEE LEOS and CPMT Societies and has authored or co-authored more than 80 publications and over 20 patents. He was awarded Agility's "Patent Award" in 2001 and 2002, Infineon's "Inventor of the Year Award" in 1999, the "Project Innovations Award" of the Siemens Semiconductor Group in 1999, and the "Best Ph.D.-Thesis Award" in 1994.

TO REGISTER:

• You may download, print and mail/FAX the registration form for PhoPack, PhoMat, and Professional Development Courses (300kB PDF).

• You may use the internet to register on-line. Note that there is a second registration page for additional free WESCON events.

• We reserve the right to cancel those Professional Development courses with inadequate registration; you will be advised by August 5th, and be allowed to switch your registration to an alternate program or get a full refund.

• Professional Development Course Organizer: Dr. Lauren Palmateer.