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DATE & TIME: Wednesday, August 13, 2003 This course has been cancelled; please select one of the remaining courses |
COST: |
| Photonics Packaging Week at WESCON -- August 10 - 14, 2003 | ||||
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| Sunday August 10 |
Monday August 11 |
Tuesday August 12 |
Wednesday August 13 |
Thursday August 14 |
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PhoPack Short Courses: Full-day Course: "Photonics Packaging: Assy & Test" or AM Course: "Photonic Device Accel Life Testing" and PM Course: "Modeling/Sim for Photonics Pkgng" |
PhoPack Sessions (Day 1) |
PhoPack Sessions (Day 2) |
PhoMat Short Courses: AM Course: "Adhesively Bonded Joints in Opto"
PM Courses (choose one): |
PhoMat Sessions |
| Register for both PhoPack and PhoMat -- take advantage of the joint-registration discount | ||||
| Free admission to all the WESCON exhibits -- included in your Symposium or Short Course registration! | ||||
OVERVIEW:
In this exciting and changing time, the electronics industry has responded and will continue to respond to the needs of competitive products in the global marketplace. The course will provide a capsule view of key segments of electronics hierarchy in market needs and new technological developments. The key areas in chip level, package level, board level as well as critical supporting materials, processes and infrastructure will be highlighted. The course will also outline the challenges in optoelectronics from a manufacturing perspective. All attendees will receive a workbook.
WHO SHOULD ATTEND:
This capsule view will provide attendees in managerial, marketing, engineering and research capacity a broad understanding of the industry as well as the quick grasp of the technological thrusts.
WHAT YOU WILL LEARN:
OUTLINE:
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ABOUT THE INSTRUCTOR:
Dr. Jennie Hwang received two masters -- from Columbia University and Kent State University's Liquid Crystal Institute -- and a doctorate from Case Western University in Materials Science & Engineering. Her primary professional interests are global market trends and technological development of the electronics industry. She has been a major contributor to the Surface Mount Technology since its inception. Serving as an advisor to major OEMs/ODMs, U.S. government and contract manufacturers, she has provided solutions to many challenging problems in manufacturing during the last 20-year's SMT establishment including U.S. F-22 program.
Dr. Hwang is an invited lecturer/keynote speaker worldwide and the author of over 200 publications, including the sole authorship of five internationally-used textbooks and a co-author of several books related to electronic interconnect technologies. She writes monthly column for SMT Magazine, addressing critical industry issues. Her books, columns, and publications have been widely cited in the industry worldwide. She also authored many articles related to trade, business, educational and social agenda.
Among her many honors and awards, Dr. Hwang is elected to the National Academy of Engineering and has received Distinguished Alumni Award from her alma maters. She also received the U.S. Congressional Certificate of Recognition and Achievements and YWCA Women of Achievement Award. She is named a Fellow of The Materials Information Society, "Leaders in Technology", "Women in Technology", "Women Role Model", and inducted to the WITI Hall of Fame (Silicon Valley). She was named one of the 28 R&D-Stars-to-Watch by Industry Week. She has held various "Woman pioneering" capacities.
Contributing to corporate governance, education and community, Dr. Hwang serves on various corporate, civic and educational boards. Dr. Hwang She has also served as the President of Surface Mount Technology Association. Having held senior executive positions at Lockheed Martin Corp., SCM Corp., IEM Corp., she is currently the president of H-Technologies Group Inc., providing technology and business solutions to microelectronics industry, focusing on partnership and joint ventures in three continents.
TO REGISTER:
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Paul Wesling.