An IEEE Professional Development Course in San Francisco

"Adhesively Bonded Joints in Micro- and Opto-Electronics"
with Dr. Ephraim Suhir, University of Illinois at Chicago, IL

Photonics Packaging Week at WESCON -- August 10 - 14, 2003
Sunday August 10	Monday August 11	Tuesday August 12	Wednesday August 13	Thursday August 14
PhoPack Short Courses: Full-day Course:     "Photonics Packaging: Assy & Test" or AM Course:     "Photonic Device Accel Life Testing" and PM Course:     "Modeling/Sim for Photonics Pkgng"	PhoPack Sessions (Day 1)	PhoPack Sessions (Day 2)	PhoMat Short Courses: AM Course:    "Adhesively Bonded Joints in Opto" PM Courses (choose one):     "Interface Adhesion & Fracture in Electr Pkgng"     "Fiber-Optics Structures: Design for Rel"	PhoMat Sessions
Register for both PhoPack and PhoMat -- take advantage of the joint-registration discount
Free admission to all the WESCON exhibits -- included in your Symposium or Short Course registration!

COURSE OBJECTIVES:
This course describes and discusss the mechanical behavior, physical design and reliability of adhesively bonded and soldered assemblies and joints used in micro- and opto-electronics.

WHO SHOULD ATTEND:
Managers, researchers, practicing engineers and all those who is interested in the future of microelectronics, photonics and other areas of "high technology", as well as in the role of mechanical, materials, packaging and reliability engineering. No special knowledge of the electrical, optical, mechanical, materials or structural engineering is required.

OUTLINE: Methods of joining materials and parts in micro- and opto-electronics Adherends, adhesives and solder materials: properties and applications Thermal stress failure problem Simplesr thermal stress model: what could be learned from using it Typical thermal stress failures in bonded assemblies Physics of stresses in, and bow of, bonded joints What could be gained by using predictive modeling Interaction of predictive modeling with experiment Finite element modeling Analytical ("mathematical") vs. finite-element modeling More complicated analytical models: Timoshenko (TM) and the Iterfacial Stress Model (ISM) Why do the interfacial stresses concentrate at the assembly ends Interaction of thermal and mechanical modeling "Equivalent" mechanical loading Stress categories, and their effect on the modes of failure

Practical example: die-attach design Role of the assembly size, adhesive material properties and thickness, curing temperature, thermal mismatch Design recommendations Shear-off testing "Global" and "local" thermal mismatch stresses, their physics and interaction Thermally matched flip-chip assemblies Stresses and strains in thermally matched assemblies Reliability testing of flip-chip solder joint interconnections Thermally matched assemblies: stresses in the adhesive layer Bi-material assemblies adhesively bonded at the ends: practical solution for large chips in flip-chip designs Thin-film assemblies Stoney's formula, and its area of application Multi-layer thin-film structures Physics of thin-film failure Prediction of thermal stresses in thin film assemblies Design recommendations Failures due to structural (design) and manufacturing shortcomings Reliability testing of adhesively bonded or soldered joints Conclusions

ABOUT THE INSTRUCTOR:
Dr. Ephraim Suhir has been a Distinguished Member of Technical Staff (ret.), Bell Laboratories, Basic Research Area, Physical Sciences and Engineering Research Division, from 1984 until 2001. He is Fellow of the ASME (American Society of Mechanical Engineers), the IEEE (Institute of Electrical and Electronics Engineers), the APS (American Physical Society) and the SPE (Society of Plastics Engineers). He is a co-founder and Editor-in-Chief of the ASME Journal of Electronic Packaging (1995-2003). Dr. Suhir has authored more than 250 technical publications (papers, book chapters, and patents), including monographs "Structural Analysis of Microelectronic and Fiber Optic Systems", Van-Nostrand, 1991, and "Applied Probability for Engineers and Scientists", McGraw-Hill, 1997. He has received numerous distinguished service and professional awards, including: 2001 IMAPS John A. Wagnon Technical Achievement Award, 2000 IEEE Outstanding Sustained Technical Contribution Award, 2000 SPE Fred O. Conley Award , and 1999 ASME and Pi Tau Sigma Charles Russ Richards Memorial Award. He is a member of the IEEE Technical Advisory Board (TAB), Distinguished Lecturer of the IEEE CPMT Society and a member of its Board of Governors. He has presented numerous invited and keynote talks at universities and professional conferences worldwide, and has taught many professional development and university courses on various topics of engineering and applied science. Dr. Suhir has organized many successful conferences and symposia in different areas of Applied Physics and Materials, and Mechanical and Reliability Engineering.

TO REGISTER:

• You may download, print and mail/FAX the registration form for PhoPack, PhoMat, and Professional Development Courses (300kB PDF).

• You may use the internet to register on-line. Note that there is a second registration page for additional free WESCON events.

• We reserve the right to cancel those Professional Development courses with inadequate registration; you will be advised by August 5th, and be allowed to switch your registration to an alternate program or get a full refund.

• Professional Development Course Organizer: Dr. Lauren Palmateer.