An IEEE Professional Development Course in San Francisco

"Interfacial Adhesion and Fracture in Electronics Packaging"
with Dr. Jianmin Qu, Packaging Research Center, Georgia Institute of Technology, GA

DATE & TIME:
Wednesday, August 13, 2003
Registration: 1:00 - 1:30 PM
Class: 1:30 - 5:00 PM 		COST:
  • IEEE Members: $150; Non-Members: $175
  • $50 discount when registering for an AM and a PM course
  • Includes class handouts and refreshments
  • You can also register for a PM Course
    • LOCATION:
    Moscone Convention Center, San Francisco in association with PhoPack and PhoMat -- held jointly with the IEEE WESCON Exhibition.

    Photonics Packaging Week at WESCON -- August 10 - 14, 2003
    Sunday
    August 10     		Monday
    August 11     		Tuesday
    August 12     		Wednesday
    August 13     		Thursday
    August 14
       PhoPack Short Courses:
    Full-day Course:
        "Photonics Packaging: Assy & Test"
    or
    AM Course:
        "Photonic Device Accel Life Testing"
    and
    PM Course:
        "Modeling/Sim for Photonics Pkgng"
         		PhoPack
    Sessions
    (Day 1)     		PhoPack
    Sessions
    (Day 2)     		   PhoMat Short Courses:
    AM Course:
       "Adhesively Bonded Joints in Opto"

    PM Courses (choose one):
        "Interface Adhesion & Fracture in Electr Pkgng"
        "Fiber-Optics Structures: Design for Rel"

    		PhoMat
    Sessions
    Register for both PhoPack and PhoMat -- take advantage of the joint-registration discount
    Free admission to all the WESCON exhibits -- included in your Symposium or Short Course registration!

    OUTLINE:
    Polymers are widely used in electronic packaging. The lack of adhesion can adversely affect reliability as well as package performance. The intention of this course is to review the fundamentals of adhesion and apply them to interfaces found in typical electronic assemblies. By the end of the course, you should know how to choose the proper tools to predict and measure adhesion as well as model interfacial failure in a variety of packages.

    WHO SHOULD ATTEND:
    Engineers, scientists and managers involved in the design, process and manufacturing of IC electronic components and hybrid packaging, electronic material suppliers involved in materials manufacturing and research & development.

    OUTLINE:

    ABOUT THE INSTRUCTOR:
    Dr. Jianmin Qu is a Professor in the School of Mechanical Engineering at Georgia Institute of Technology. He received his Ph.D. in theoretical and applied mechanics from Northwestern University. He was a postdoctoral research fellow at the University of Pennsylvania for two years before joining Georgia Tech in 1989. He has received a number of awards for excellence in teaching and research including the Lilly Teaching Fellow Award, the Amoco Junior Faculty Teaching Excellence Award, the Dow Outstanding Young Faculty Award, Sigma Xi Yang Faculty Award, Ralph R. Teetor Education Award, etc. He is Fellow of ASME and an Adjunct Professor at Harbin Institute of Technology, China and a visiting Professor at the University of Metz, France. He has conducted extensive research in the general area of thermomechanical reliability of materials and advanced packages with over 140 papers published. His research has been sponsored by several government agencies (NSF, ONR, DARPA, AFRL) and a number of industries (AT&T, Ford, IBM, Motorola, AMD, and others).

    TO REGISTER:

    Last updated on || Send comments to Paul Wesling.