An IEEE Short Course in the S. F. Bay Area

Title:
"INTRODUCTION TO MODERN SEMICONDUCTOR PACKAGING"
with Dr. John Newman and Dr. Robert Dubin

Please Post and Circulate, through February 23, 2000

About This Short Course series
Course Overview
About the Instructor
How to Register


DATE & TIME:
Wednesday, February 23, 2000, from 12:30 - 5:00 PM
Registration and Buffet Lunch: Noon - 12:30 PM

LOCATION:
UC Extension, 1180 Bordeaux Drive, Sunnyvale, near Highway 237 & Mathilda

SPONSOR:
The Institute of Electrical and Electronics Engineers: the Components, Packaging, and Manufacturing Technology Society Chapter.

COST:
IEEE Members: $225; Non-Members: $235
includes class handbook, lunch and refreshments.

INFORMATION:
Contact Dr. Bob Dubin (650) 592-0315 or Dr. John Newman (408) 978-1069 (FAX# 408-978-1069)

OVERVIEW:
A straightforward text and graphics format is used to introduce modern and advanced packages, packaging design issues, and basic processing concepts. Key design and performance aspects of QFP, BGA, Flip Chip, and Small Form-factor package technologies are explored. Application issues are reviewed to help you learn how to choose the right package.

WHO SHOULD ATTEND:
ASIC designers, Field Support, Marketing, Design Engineers, and others needing an introduction to modern semiconductor packages and packaging technologies, and others who evaluate present packages and influence future electronic packaging decisions in their companies.

TOPICS:

ABOUT THE INSTRUCTORS:
Dr. John Newman and Dr. Robert Dubin are partners and founders of J. R. Technical Associates which specializes in customized technical education and training for the workplace. Both are experienced "hands-on" contributors and active consultants to Silicon Valley industries.


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Revised 31 January 2000