Title:   "Achieving High Reliability for Lead-Free Solder Joints - Materials Considerations"
with Dr. Ning-Cheng Lee, Indium Corp.

Please Post and Circulate, through Oct. 1, 2007

LOCATION:
Holiday Inn San Jose
1740 North First Street, San Jose

SPONSOR:
The Institute of Electrical and Electronics Engineers: the Components, Packaging, and Manufacturing Technology Society Chapter.

COST:
IEEE Members: $300 for half-day Course; $450 for full day (2 Courses)
Non-Members: $350 for half-day Course, $500 for full day (2 Courses)
See descriptions of all 7 Courses in the Advance Program.
REGISTER at our on-line registration site, or use the printed Symposium Advance Program form.

OVERVIEW:
This course covers the detailed materials considerations required for achieving high reliability for lead-free solder joints. The reliability discussed includes joint mechanical properties, development of type and extent of intermetallic compounds (IMC) under a variety of material combinations and aging conditions, and how those IMCs affect the reliability. The failure modes, thermal cycling reliability, and fragility of solder joints as a function of materials combination, thermal history, and stress history will be addressed in detail, and novel alloys with reduced fragility will be presented.

Electromigration, corrosion, and tin whiskers will also be discussed. Furthermore, the reliability of through-hole solder joints will be reviewed, and recommendations will be provided, particularly for thick boards. The emphasis of this course is placed on the understanding of how various factors contribute to the failure modes, and how to select proper solder alloys and surface finishes for achieving high reliability. Also to be presented are the desirable future alloys and fluxes in order to meet the challenge of miniaturization.

Course Outline:

Prevailing Materials: Solder Alloys; Surface Finishes
Mechanical Properties: Shear & Pull Strength; Creep
Intermetallic Compounds
• Interaction of Cu and Ni
• Effect of Cu Content in SAC
• Effect of Ni in Cu Pad
• Effect of Alloy Additives
  Failure Modes
• Grain Boundary Sliding & Cavitation
• Grain Coarsening
• Grain Orientation
• Lead Contamination
• Mixed Alloys
• Interfacial Voiding
  Thermal Cycle Reliability
• Thermal Cycle Tests
• PCB Surface Finish Cu vs Ni
• Effect of Reflow Temp
• Reworked SMT Joints
  Reliability of Through-Hole Joints
• Fragility/effects of Lead-Free Solder Joints; of Component Finish; of IMC Thickness; of Isothermal/Thermal Aging; of Intermetallic Morphology; Novel Alloys with Reduced Fragility
• Electromigration: Influence of Temperature/Current on Resistance, IMC Thickness, Mechanical Properties
• Corrosion with SAC405; with PWB Finishes
• Tin Whiskers

Intended Audience
This course is targeted to those wishing to understand high reliability lead-free solder joints and how to achieve them.

ABOUT THE INSTRUCTOR:
Dr. Ning-Cheng Lee is the Vice President of Technology of Indium Corporation of America. He has been with Indium since 1986. Prior to joining Indium, he was with Wright Patterson Air Force Base Materials Laboratory, Morton Chemical, and SCM. He has more than 22 years of experience in the development of fluxes and solder pastes for the SMT industry. He received his PhD in polymer science from University of Akron in 1981 and a BS in chemistry from National Taiwan University in 1973.

Ning-Cheng is the author of Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP, and Flip Chip Technologies and co-author of Electronics Manufacturing with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials. He is also the author of book chapters for several lead-free soldering books. He is honored as 2002 SMTA Member of Distinction, and received 2003 Lead-Free Co-Operation Award from Soldertec, and received 2006 Exceptional Technical Achievement Award from the IEEE’s CPMT Society. He serves on the board for SMTA, and has also served on the board of governors for CPMT.