An IEEE Short Course in the S. F. Bay Area

Title:
"RF Package Test -- Measurement and Characterization"
with Dr. Scott Wartenberg, RF Micro Devices

Please Post and Circulate, through June 25.

About This Short Course series
Course Overview
About the Instructor
How to Register

LOCATION:
UC Extension, 1180 Bordeaux Drive, Sunnyvale, near Highway 237 & Mathilda
Print out the map to the UCSC site.

SPONSOR:
The Institute of Electrical and Electronics Engineers: the Components, Packaging, and Manufacturing Technology Society Chapter.

COST:
IEEE Members: $225; Non-Members: $249
includes class handbook, lunch and refreshments.

INFORMATION:
Contact Dr. Bob Dubin (650) 592-0315.

OVERVIEW:
Understanding the RF performance of a packaged die is often underestimated and neglected by the designer until the last moment. Yet the package has a demonstrable impact on the final product's performance. This half day short course covers how to characterize packages, both empty and with die inside. The test fixture is broken down section by section, explaining the RF aspects of its design. Calibration issues are also discussed. At the end, RF characterization of a few popular package styles is covered.

WHO SHOULD ATTEND:
Electronic packaging and design engineers, test engineers, project managers, reliability, failure analysis, and field support engineers, and others who influence electronic packaging and product testing decisions in their companies.

TOPICS:

• Techniques to RF characterize packages
• Example of how to model a package
• Test fixture design for measuring packages
• Test Fixture calibration issues

ABOUT THE INSTRUCTOR:
Dr. Scott Wartenberg is senior test engineer in the RF Power Amplifier Products group at RF Micro Devices (RFMD) in Greensboro, NC. RFMD is the leading supplier of RF power amplifiers for the cellphone industry and Dr. Wartenberg supports the final RF test of power amplifier products. He designs test boards and test sockets for high-volume RF testers. He has recently authored a book "RF Measurements of Die and Packages" available from Artech House.

HOW TO REGISTER:

         FEES:      IEEE Members:         $225  
                    other attendees:      $249
     (includes class handbook, lunch, and refreshments)
  Checks or P.O.s should be made payable to "IEEE/CPMT"
  and sent with the completed registration form below to:
                    J. R. Technical Assoc. 
                    PO Box 5183
                    Belmont, CA 94002

Registration for IEEE Members ($225):
Registration for Non-Members ($249):

--------------------------------------------------------------------------
                         REGISTRATION FORM
         RF PACKAGE TEST -- Measurement and Characterization  
               Wednesday, June 25, 2003, Noon - 5 PM

  EMAIL your Registration Form to: myregistration@pacbell.net
    ---Copy to: jrtech@pacbell.net
    ---Include "C-6-25-03 REGISTRATION" in the Subject
    ---Send payment later
  Or: Call Dr. Bob Dubin for more Information: (650) 592-0315

  Mail Payment With A Copy Of Your Registration Form To:
  J.R. Technical Associates, Attention: Short Course Registrations 
       PO Box 5183, Belmont, CA 94002
  Make Checks and Purchase Orders payable to "IEEE-CPMT".

Credit Card Payments Accepted Only Through our Online PayPal Account (above)
  --Email your Registration Form to:  myregistration@pacbell.net 
  --Forward a copy of your PayPal receipt to:  myregistration@pacbell.net

  Payment due by 5PM Friday before class.  CHECKS PREFERRED.

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              If you can't attend, what about a Team Member?
                                                        C-62503-JW1