An IEEE Short Course in the S. F. Bay Area

Title:
"SMT SOLDER JOINT RELIABILITY:
DESIGN, MANUFACTURE & PREDICTION"
with Werner Engelmaier

Please Post and Circulate, through Feb. 20, 1998

About This Short Course series
Course Overview
About the Instructor
How to Register

LOCATION:
UC Extension, 1180 Bordeaux Drive, Sunnyvale, near Highway 237 & Mathilda

SPONSOR:
The Institute of Electrical and Electronics Engineers: the Components, Packaging, and Manufacturing Technology Society Chapter.

COST:
IEEE Members: $175; Non-Members: $225
includes class handbook, lunch and refreshments.

INFORMATION:
Contact Dr. Bob Dubin (650) 592-0315 or Dr. John Newman (408) 978-1069 (FAX# 408-978-1069)

OVERVIEW:
Adequate reliability of surface mount solder attachments can only be assured with a 'Design for Reliability' approach based on solder joint behavior and underlying fatigue damage mechanisms. This short course puts the issues of solder joint quality, manufacturability, and reliability into context. It explores the nature of the reliability hazard, solder joint design parameters, material properties, and a solder fatigue model. Appropriate 'Design for Reliability' procedures and manufacturing issues resulting in quality solder joints are presented. A numerical example is worked through to demonstrate the use of these concepts. Attendees will learn to optimize assembly design and estimate the reliability of high density surface mount solder attachments.

WHO SHOULD ATTEND:
Packaging engineers and technical personnel involved in: design, process, testing, failure analysis, and reliability of electronic packaging.

TOPICS:

• Solder Joint Characteristics and Stress
  • Creep, Stress Relaxation, Fatigue, Use Environments, Testing
• Reliability Prediction Model
  • Physics-of-Failure, Statistical Failure Distributions
• Design For Reliability
  • Design Parameters, Design Life, Acceptable Failure Probability
• Quality In Manufacturing
  • Solderability, Soldering, Stress Screening

ABOUT THE INSTRUCTOR:
Werner Engelmaier has over 32 years experience in electronic packaging and interconnection technology, including 24 years at Bell Laboratories. He is the author of over 120 publications, IPC Product Reliability Committee chairman, and recipient of the IEPS Electronic Packaging Achievement Award. He is president of Engelmaier Associates Inc., a reliability consulting firm, and holds mechanical engineering degrees from MIT, USC, and TGM in Vienna.