An IEEE Short Course in the S. F. Bay Area

Title:
"THERMAL DESIGN AND MODELING OF IC PACKAGES"
with Dr. Sam Z. Zhao, Broadcom Corporation

Please Post and Circulate, through December 15.

About This Short Course series
Course Overview
About the Instructor
How to Register

LOCATION:
UC Extension, 1180 Bordeaux Drive, Sunnyvale, near Highway 237 & Mathilda
Print out the map to the UCSC site.

SPONSOR:
The Institute of Electrical and Electronics Engineers: the Components, Packaging, and Manufacturing Technology Society Chapter.

COST:
IEEE Members: $225; Non-Members: $249
includes class handbook, lunch and refreshments.

INFORMATION:
Contact Dr. Bob Dubin (650) 592-0315.

OVERVIEW:
This short course provides a systematic approach to the understanding of IC package-related thermal issues, thermally enhanced packages, industry standard thermal tests, IC package thermal modeling techniques, and system thermal design using IC package compact and detailed thermal models.

Students completing this class should gain basic understanding of IC package thermal characteristics, improve their ability and understanding to make appropriate IC package technology selection and system design decisions, and to achieve reliable performance of complex electronic devices.

WHO SHOULD ATTEND:
Packaging engineers, system engineers, thermal and mechanical engineers, PCB layout engineers, field support personnel, marketing personnel, design, process, failure analysis, and reliability engineers.

TOPICS:

• Understanding IC Package Thermal Data
  • Theta-ja, Theta-jb, Theta-jc, Psi-jt
• IC Package Thermal Enhancement Design
  • Minimization of Theta-jc:
    • Exposed Pad, Heat Spreader, TBGA, Flip Chip, Others
  • Minimization of Theta-jb:
    • Exposed Pad on Board, Drop-in Heat Sink, Thermal Vias, Ground Balls
• JEDEC Standards for Package Thermal Characterization
  • Still Air Test, Wind Tunnel Test, Theta-jb Measurement Discussion
• Thermal Modeling of IC Packages
  • Guidelines for Computational Fluid Dynamics (CFD) Based Simulations
  • Guidelines for Heat Conduction Based Simulations
  • Example of a Package Level Simulation: JEDEC Thermal Characterizations
  • Example of a System Level Simulation using compact and detailed package models: Network Switching Box

ABOUT THE INSTRUCTOR:
Dr. Sam Z. Zhao is a Senior Staff Scientist at Broadcom Corporation. He received his Ph.D. from the University of Illinois at Chicago and has worked at the Swiss Federal Institute of Technology (ETH), in Zurich, as well as ASAT Inc., a packaging house in Fremont, CA. He has published more than 30 technical articles in peer-reviewed journals and conference proceedings.

HOW TO REGISTER:

         FEES:      IEEE Members:         $225  
                    other attendees:      $249
     (includes class handbook, lunch, and refreshments)
  Checks or P.O.s should be made payable to "IEEE/CPMT"
  and sent with the completed registration form below to:
                    J. R. Technical Assoc. (Attn: Short Course Reg'n) 
                    PO Box 5183
                    Belmont, CA 94002

Limited Seating.  Register by EMAIL NOW to reserve your seat!
Your registration will be CONFIRMED when payment is received.
Checks and Purchase Orders should be made out payable to "IEEE-CPMT".
Credit Card Payments Through PayPal Only -- see below.

Registration for IEEE Members ($225):
Registration for Non-Members ($249):

--------------------------------------------------------------------------
                         REGISTRATION FORM
            THERMAL DESIGN AND MODELING OF IC PACKAGES 
            Wednesday, December 15, 2004, Noon - 5 PM

  EMAIL your Registration Form to: myregistration@pacbell.net
    ---Copy to: bobdubin@pacbell.net
    ---Include "C-12-15-04 REGISTRATION" in the Subject
    ---Send payment later
  Or: Call Dr. Bob Dubin for more Information: (650) 592-0315

  Mail Payment With A Copy Of Your Registration Form To:
  J.R. Technical Associates; Attn: Short Course Registration;
                             PO Box 5183, Belmont, CA 94002
  Make Checks and Purchase Orders payable to "IEEE-CPMT".

Credit Card Payments Accepted Only Through our Online PayPal Account (above)
  --Email your Registration Form to:  myregistration@pacbell.net 
  --Forward a copy of your PayPal receipt to:  myregistration@pacbell.net

  Payment and cancellation refund requests due by 5PM Friday before class.
  Substitute attendees accepted anytime.  


NAME________________________   COMPANY________________________

ADDRESS__________________________ JOB TITLE___________________

CITY_____________________STATE__________ZIP____________________

Phone______________ Include FAX# for Confirmation______________

Email_______________________________________________

Manager's Name ___________________ Manager's Email: ___________

Payment by:
Check #_____________  PayPal____________________  P.O._________

Amount $________ IEEE# ________________ (Required For Discount)

              If you can't attend, what about a Team Member?
                                                        C-12-15-04