Dr. Martin Goetz

past Chair, Santa Clara Valley Chapter, CPMT Society

Martin served 6 years in the US Air Force as a security specialist for Titan II ICBMs in the Strategic Air Command. He attended the Georgia Institute of Technology, where he also worked for the Georgia Tech Television Network. He later graduated from the Southern Polytechnic State University, where he received a BSEET, with a focus on communications systems theory. Also while in school, he worked for CNN, Headline News and WTBS Television stations, in different areas of production engineering and WGHR radio as a broadcaster.

He moved to San Diego and designed crystal oscillators for Monitor Products, before getting involved in microelectronic ceramic packaging development at Alcoa Electronic Packaging and Stratedge Corp. He then moved to Silicon Valley to work for ASAT and later at start-up Alpine Microsystems developing silicon-on-silicon 3D technology. From there he headed to Dallas, TX to work for another start-up, Clarisay, developing RF Surface Acoustic Wave filters. He's now residing at IBM in Research Triangle Park, NC where he oversees business operations in the Electronic Packaging Integration department, under Integrated Systems Development in the Systems & Technology Group. He also is involved in 3D silicon design for microprocessor integration. Martin continued his education over the years, with MS Eng from California Coast University and PhD EE studies from Kensington University and recently an MBA from the University of North Carolina at Chapel Hill Kenan-Flagler Business School. He is currently in a MA Liberal Studies program at North Carolina State University with a concentration on Science, Technology & Society.

He stays current with the industry, having published and presented over 60 papers in various journals, publications, and conferences. He is currently the chair of the CPMT TC-3 committee on IC and Package Assembly and former chairman of the EIA/JEDEC JC15 committee on Electrical - Thermal Characterization Techniques for Electronic Packages and Interconnects. He has also been an industry consultant to Hewlett Packard for their High Speed Digital and Materials Measurement Symposiums. He has 17 patents and another 15 patents pending. He is a senior member of IEEE CPMT and held membership in both the MTT and Communications societies over the years.

He can be reached by email.