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We welcome you to Silicon Valley, the home of the Santa Clara Valley Chapter of the Components, Packaging & Manufacturing Technology Society! We're quite active, with a regular series of Monthly Evening Meetings, a series of Luncheon Meetings, and a rich choice of technical and professional skills courses.

Upcoming IEEE/CPMT Society Events In the Santa Clara Valley   (Print out and post/circulate)
Monthly Technical Meetings:
(everyone is welcome!)
Technical/Skills/Management Short Courses:
Meetings for 2010/2011:

* "Reliability from the LED System Perspective -- As Strong as the Weakest Link" Mark Hodapp, Philips Lumileds Lighting -- dinner Wednesday, February 8

* "3D Chip Stacks: New Nano Thermal Interface Materials" Srilakshmi Lingamneni, Stanford University -- dinner Wednesday, March 14

Downloadable Slides and Webcasts from Recent Talks (most recent last)

"Fine-Grained 3D Integration", Deepak Sekar, MonolithIC 3D Inc. (750 kB PDF)
"Soft Error Rate (SER) Workshop", 9 presentations -- view Webinar, download handouts
"2.5D and 3D TSV Products", Phil Marcoux, PPM Associates (750 kB PDF)
"Silicon Carbide (SiC) Sensing Technology for Extreme Harsh Environments", Debbie G. Senesky, Ph.D., University of California, Berkeley (1.4 MB PDF)
"Memory Scaling and Its Potential Impact on Computing and Storage", Debbie Ed Doller, Micron Technology (1.4 MB PDF)
"Developments in MEMS Packaging", Alissa M Fitzgerald, AMFitzgerald and Associates (1.4 MB PDF)
"Embedded Passives: Packaging Paradigm of the Future?", Jason Ferguson, Crane Naval Surface Warfare Center (1.4 MB PDF)
"Impact of Packaging on Photovoltaic Panel Performance and Reliability", Alelie Funcell, Renewable Energy Test Center (550kB PDF)
"Novel Fine Pitch, Low Profile, Low Cost Connector Technology", David Light, VP Technology, Neoconix (1.6 MB PDF)
Three-Hour SEMINAR: Second Annual "Soft Error Rate (SER) Workshop", Seven 20-minute talks; slides and WebEx viewing; links (10 MB ZIP)
Two-Hour SEMINAR: "Moore's Law for System Integration", Prof. Rao Tummala, NSF Packaging Research Center, Georgia Tech (3.4 MB PDF)
Other Slides from Past Talks: See the CPMT Members-Only website.

Upcoming Conferences sponsored by our Chapter

* Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM 2012) at the DoubleTree Hotel, San Jose -- March 18-22, 2012.

Chapter Newsletters:
Please download and print our Newsletter; pass it along to a non-member with an interest in materials and packaging technology.
* Summer 2011 -- 400 kB
* Summer/Fall 2010 -- 800 kB
* Winter/Spring 2010 -- 200 kB

Professional Skills Development and Management Classes:

Contact Sue Smith, our course registrar, to receive the Course Flyer in the mail, and to be added to our email notification list for other winter classes.

Project Management: Team-Based Accountability - PMI Certified [more]   - November 8-9 at TIBCO Software, Palo Alto
Delegation and Coaching: The Winning Combination [more]   - November 17 at TIBCO Software, Palo Alto
Clear Business, Technical, and Email Writing [more]   - November 30 at TIBCO Software, Palo Alto
Meeting Management [more]   - December 1 at TIBCO Software, Palo Alto
Presentation Skills for Engineers [more]   - December 6 at Cypress Semi, San Jose

Other IEEE Events around Silicon Valley and the SF Bay Area:

Please visit the Council's e-GRID website to see what interesting technical talks are being scheduled by other Chapters.

ExCom Members Login:
ExCom members may log into our Google Sites/Apps website.

See our listing of Past Meetings and Courses.
[Place yourself on our email distribution list or send a request to Paul Wesling.]


Ideas for Future Meetings?
Do you have an idea for a presentation on a topic in our technical-interest area? You can review the Guidelines for CPMT Chapter Speakers (10 kB PDF). Please contact one of our officers or any of the members of our Program Committee with your proposal:
Officers:
Chapter Chair: Mudasir Ahmad, Cisco Systems
Vice Chair: Ed Aoki, Agilent Technologies, Retired
Treasurer: Azmat Malik
Secretary: Elizabeth Logan
Program Co-Chairs:
Dinner Meetings: Harvey Miller, InfraFocus, and Azmat Malik
Lunch Meetings: Sandra Winkler, and Tom Tarter
Program Support:
A/V Support: Tom Tarter
Dinner Meetings: Janis Karklins
Lunch Meetings: Hassan Ali
and Ed Stoneham
Publicity: Paul Wesling

Design Issues:
Oscar MahinFallah: EMC

Components Issues:
(vacant): embedded pasives design & fabrication

Packaging Issues:
Bill Chen: IC packaging/materials
(vacant): 3D, high-density
(vacant): nano and opto packaging
Phil Marcoux: Wafer Level Packaging and Packaging for MEMs
(vacant): Sensors packaging (imaging, bio, RFID, etc.)

  Reliability and Qualification Testing:
Jim Krepelka, Agilent Technologies: Reliability, life, qualification testing

Manufacturing and Assembly:
(vacant): EMS, DFX and electronic assembly process development
Phil Marcoux: business and outsourcing issues
Luu Nguyen: Green Electronics, lead-free/halogen-free

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