Who we are
The Olympic Torch
Local evening IEEE meetings
for the month
(from the GRID Calendar)
Search IEEE XPLORE for on-line journal and conference papers
(<=== click on the map, for a better view)
We welcome you to Silicon Valley, the home of the
Santa Clara Valley Chapter of the Components, Packaging & Manufacturing Technology
Society! We're quite active, with a regular series of Monthly Evening
Meetings, a series of Luncheon Meetings, and a rich choice of technical and professional skills courses.
Upcoming IEEE/CPMT Society Events
In the Santa Clara Valley
(Print out and post/circulate)
See our listing of Past Meetings and Courses.
|Monthly Technical Meetings:
(everyone is welcome!)
|Technical/Skills/Management Short Courses:
Meetings for 2012/2013:
"A Comparison of Low-Cost Interposer Technologies"
Terry Kang, Sr. Packaging Development Manager, Nvidia
-- lunch Thursday, May 23
"NanoCopper Materials Platform for Electronics Packaging and Printed Electronics with 200C Processing Temperature"
Alfred Zinn, Senior Scientist, Lockheed Martin Space Systems Company ATC
-- dinner Wednesday, June 12
"Wafer Level Packaging: A Foundry Perspective"
-- Michael Shillinger, Founder, Innovative Micro Technology
-- lunch Thursday, June 27
Downloadable Slides and Webcasts from Recent Talks (most recent last)
"Packaging: The Core of Competitive Advantage"
Bill Chen, Fellow of ASE Group (1.7 MB PDF)
"New Embedded Package Technology using Large-Scale Panel Assembly (FO-WLP)"
Akio Katsumata, J-Devices Corporation (900 kB PDF)
"Advanced Organic Substrate Technologies to Enable Extreme Electronics Miniaturization"
Susan Bagen, Endicott Interconnect Technologies, Inc. (1.8 MB PDF)
"Packaging for the Cloud Computing Era"
Ilyas Mohammed, Invensas (3.5 MB PDF)
"A New Class of Ultra Low-k for Advanced Interconnects: Fundamentals and Application of Silicon Carbide Hybrid Glasses"
Yusuke Matsuda, Stanford University (1.2 MB PDF)
Other Slides from Past Talks: See the Listing of past Chapter meetings for the topic of your choice.
Please download and print our Newsletter; pass it along to a non-member with an interest in materials and packaging technology.
Summer 2011 -- 400 kB
Summer/Fall 2010 -- 800 kB
Winter/Spring 2010 -- 200 kB
Professional Skills Development and Management Classes:
Sue Smith, our course registrar, to receive the Course Flyer in the mail, and to be added to our email notification list
for other spring classes.
Effective Presentation Skills
May 21 at NetGear, San Jose
Transitioning from Individual Contributor to Manager
June 6 at Altera, San Jose
Other IEEE Events around Silicon Valley and the SF Bay Area:
Please visit the Council's e-GRID website to see what interesting technical talks are being scheduled by other Chapters.
ExCom Members Login:
ExCom members may log into our Google Sites/Apps website.
[Place yourself on our email distribution list or send a request to
Ideas for Future Meetings?
Do you have an idea for a presentation on a topic in our technical-interest area? You can review the Guidelines for CPMT Chapter Speakers (10 kB PDF).
Please contact one of our officers or any of the members of our Program Committee with your proposal:
Oscar MahinFallah: EMC
(vacant): embedded pasives design & fabrication
Bill Chen: IC packaging/materials
(vacant): 3D, high-density
(vacant): nano and opto packaging
Phil Marcoux: Wafer Level Packaging and Packaging for MEMs
(vacant): Sensors packaging (imaging, bio, RFID, etc.)
Reliability and Qualification Testing:
Jim Krepelka, Agilent Technologies: Reliability, life, qualification testing
Manufacturing and Assembly:
(vacant): EMS, DFX and electronic assembly process development
Phil Marcoux: business and outsourcing issues
Luu Nguyen: Green Electronics, lead-free/halogen-free