Components, Packaging & Manufacturing Technology Society

IEEE/CPMT Dinner Meeting:

"Issues in Electronics Cooling" --
Moderated by Bernie Siegal, Thermal Engineering Associates, with Roger Emigh, Ph.D., Advanced Thermal Solutions; William Maltz, Electronic Cooling Solutions, Sarang Shidore, Flomerics

Wednesday, April 12, 2000
Subsidized buffet dinner ($15 if reserved before April 9; $20 after & at door) served at 6:30; Presentation (no cost) at 7:30.
New Location: Embassy Suites Hotel, 2885 Lakeside Drive (101 at Bowers Ave), Santa Clara -- see map.
PLEASE RSVP (for dinner and/or meeting) by email to Tom Tarter, or call our CPMT hotline at 800-686-9366.

Thermal Measurement Standardsí Status (ppt, 150kB): Bernie Siegal, Thermal Engineering Associates
A review of thermal parameter terminology and symbols incorporated into the latest EIA/JEDEC JESD-51 thermal measurement standards. Definitions of key thermal parameters and discussion of heating time impact will be presented. The JEDEC JC15.1 subcommittee roadmap on semiconductor packaging thermal issue will be discussed, covering both existing standards, standards currently under development, and standards planned for future work.
In Situ Airflow and Temperature Measurement (ppt, 3MB): Roger Emigh, Ph.D, Advanced Thermal Solutions, Inc
Liquid Crystal Thermography (LCT) is a technique that allows in situ thermal characterization by providing a visual temperature profile over an area of interest. It can be applied to a wide variety of micro-electronic systems (packages, boards, full computer or telecom systems, etc.) to aid in understanding and improving their thermal design. LCT is accomplished by applying an electrically insulating, liquid crystal material to the entire surface. The material changes color in response to temperature changes and can be formulated to respond over various temperature ranges. Standard image analysis techniques can then be applied as desired delivering very accurate temperatures and good spatial resolution. For enclosed systems, transparent materials, such as Plexiglas, can be used to visually expose the area of interest without altering airflow or temperature characteristics within enclosed systems. The thermal designer can find great benefit from this technique of in situ temperature characterization.
Issues in the Cooling of Electronic Systems (ppt, 1MB): William Maltz, Electronic Cooling Solutions, Inc.
A practical approach to system level thermal design will be presented. A design process for a chassis to be used in the telecommunications industry will be used as an example. The presentation will address some of the specific requirements for that industry and some of the design constraints that impact cooling. The presentation will also suggest an approach or design methodology that will lead to a successful thermal design. Included will be a discussion of how simulation modeling and experimental work can be used efficiently and in conjunction with each other in the design process.
Recent Trends in IC Package Thermal Modeling (ppt, 750kB): Sarang Shidore, Flomerics Inc.
The Flip-Chip Plastic Ball Grid Array (FC-PBGA) is a package style that is rapidly gaining acceptance in the industry. In this study, a detailed model of a Flip-Chip PBGA was constructed based on information regarding the package construction. The model was then validated against existing experimental data for standard (JEDEC) forced and still air environments. The agreement between the model and experimental junction temperatures was found to be acceptable (within 12%). The model was then used in designing a thermal solution for eventual use in a telecommunications system. A satisfactory thermal design that could meet the junction temperature constraint was achieved. Finally, a compact model was derived from the validated detailed model using the methodology proposed by the DELPHI project. The accuracy of the compact model was evaluated by comparing simulation results with the detailed model for still air and forced convection (JEDEC) standard environmental conditions.
Speaker Biographies:
[to be added]

If you are not on our Chapter's regular email or FAX distribution list for meeting anouncements, you can easily be added! Please send an Email to Tom Tarter and let me know if you'd like email or FAX distribution. If you don't have Email, then please reply to 800 686-9366 (CPMT's 800 number), but please be advised that I would greatly prefer the Email route.

SCV Chapter Home Page
How to Join IEEE
Contact our Chapter Chair
CPMT Society Home Page
IEEE Home Page
Email to Webmaster
Revised 25 April 2000