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OVERVIEW:

In the past two decades, microprocessor speeds have outpaced the memory bus leading to clearly a bottle-neck. Rambus has developed a new technology that solves this problem. Rambus DRAM can transfer 16 bit data at speeds as high as 800 MHz while delivering a 1.6 Gbits/s bandwidth. Lately, speed of 1.066 GHz for short channel and a per-pin data transfer rate of 1.6 Gbits/s on a 400MHz bus for QRSL were announced. To achieve this milestone, the electrical, mechanical and thermal characteristics of die packaging became very important. And in this talk we tackle these issues as well as the various packaging technologies that are applicable.

Speaker Biography:

Belgacem (Bel) Haba received his MS and PhD in Materials Science and Engineering from Stanford University, California. From 1999, he has been managing the packaging development program at Rambus Inc. Prior to joining Rambus, he worked at Tessera for three years as a manager of the wafer level packaging and the high density multi-layer substrate activities and as a Fellow of Tessera. From 1988 to 1996, Dr Haba's activities focused on the applications of lasers in many areas of microelectronics while working both at the IBM Watson Research Center in New York and at the NEC Central Research laboratories in Japan. Dr. Haba has authored numerous technical papers and patents and disclosures.