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OVERVIEW:

The semiconductor industry has always led in shrinking chip feature geometries compared to the board industry, creating a "gap" that challenged the packaging community to find low cost solutions for connecting the chips to the outside world As the industry enters the sub-quarter micron era and pin-counts on the chip escalate into the 1000s, conventional substrate technologies are unable to bridge these tight geometry devices to the next level of interconnect on the board. A thin film solution that uses wafer fab-like process steps built in a large panel flat-panel display-like equipped high volume facility that leverages conventional board interconnect technologies clearly appears to be what the industry needs. These thin film structures are fabricated on large panels to achieve cost efficiencies onto organic boards that mate in a BGA format to the next level of interconnection.

Speaker Biography:

Jack Belani: MS Materials and Metallurgical Engineering, Illinois Institute of Technology, and a B.Tech from the Indian Institute of Technology. Currently President of X-LAM Technologies unit of Kulicke & Soffa Industries. Vice President of Assembly and Packaging at Cypress Semiconductor for 3.5 years, Director of Package Technology at National Semiconductor for 19 years.