Components, Packaging & Manufacturing Technology Society

IEEE/CPMT Dinner Meeting:

"Flip Chip Package Development at LSI Logic" --
Ed Fulcher

Wednesday, April 11, 2001
  • Seated dinner served at 6:30 ($20 if reserved before April 8); $25 after & at door; vegetarian available)
  • Presentation (no cost) at 7:30.

    Ramada Inn

  • 1217 Wildwood Ave (Fwy 101 frontage road, between Lawrence Expressway and Great America Parkway), Sunnyvale, (800) 888-3899 -- see map.


  • For dinner and/or meeting: by email to Tom Tarter
  • or call our CPMT hotline at 1-650-299-8898.
  • Please reserve for "presentation-only", even if not attending the dinner.

    Flip Chip Package Development at LSI Logic - Exercising the KISS Principle and Dual Functionality to Develop Multiple Families of Organic Flip Chip Packages with High Performance and Low Cost

    Speaker Biography:
    Ed Fulcher is Director of Package Development at LSI Logic for the past 10 years. Previously he was Director of Package Development, Assembly, and Memory Systems at Unisys. Ed has been a pioneer in the paradigm shifts to BGAs, and to organic flip chip packages. He did his undergraduate work in electrical engineering at Princeton and U. of Maryland, and his graduate work in electrical engineering at U. of Florida and business at Stanford.

    If you are not on our Chapter's regular email or FAX distribution list for meeting anouncements, you can easily be added! Please send an Email to Tom Tarter and let me know if you'd like email or FAX distribution. If you don't have Email, then please reply to 800 686-9366 (CPMT's 800 number), but please be advised that I would greatly prefer the Email route.

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    Revised 14 March 2001