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OVERVIEW:

This talk centers around packaging opportunities for professionals in microelectronic, disk drive, and system packaging. These opportunities are emerging in the form of mechanical, electrical, thermal, and structural engineering disciplines and provide a chance for those of us in the microelectronic world to take part in this new and exploding area of packaging. Challenges in this area include mechanical and structural, electronic, temeprature control and heat transfer, materials science, control systems and of course, optical engineering.

Due to the fact that this industry is new, best practices and standardization of form factors, materials, and interconnections are still emerging. This need provides an excellent motivation to look into how traditional methods of packaging and automation can be applied both in the packging and system level engineering areas. The need for standardization is dire, and with this need comes the requirement that the industry starts talking on a practical level about how we can focus on simple standards that will help drive down the cost of production as well as simple and reliable application at the end user.

The transition from microelectronics to optoelectronics is also discussed from the author's point of view, having gone through it on a first-hand basis.

Overall, the speaker will try to generate interest in this new and exciting field to further advance the state-of-the-art in advanced packaging.

Speaker Biography:

Tom Tarter has worked in the Silicon Valley for nearly 20 years in the area of packaging. He spent 17 years at Advanced Micro Devices as a packaging and performance characterization specialist, performing thermal and electrical modeling and measurement for AMD products. Over this time he has written and published over 30 white papers and articles on thermal and electrical phenomenon, standards, and applications for microelectronic and optoelectronic packaging. He has also presented several short courses and invited papers at conferences and events worldwide. Tom has been active in community, national, and international standards development. He has been involved in the JEDEC JC15 Committee on Thermal and Electrical Phenomenon in Microelectronic Packaging since its inception and has served as the Chairman for the JC15.1 thermal subcommittee for five years, and as general chairman for the JC15 thermal and electrical groups for the last two years. He is currently the secretary for the Silicon Valley Chapter of the IEEE/CPMT and works closely with the staff to organize meetings, talks, symposiums and conferences. Tom is also on the executive committee of the IEEE Semi-Therm conference on thermal phenomenon, and serves as a consulting member on optoelectronic packaging. His current endeavor is in the analysis, control, and application of thermal sciences to optoelectronic packaging at Lightwave Microsystems in San Jose, California. Tom is a member of IEEE, CPMT, SPIE, and OSA.