IEEE/CPMT Dinner Meeting:
Plating Processes for IC and Microelectronic Interconnect Applications --
Wednesday, November 14, 2001
Seated dinner served at 6:30
($20 if reserved before Nov. 10); $25 after & at door;
Presentation (no cost) at 7:30.
Ramada Inn1217 Wildwood Ave (Fwy 101 frontage road, between Lawrence Expressway and Great America Parkway), Sunnyvale, (800) 888-3899 -- see map.
PLEASE RESERVE IN ADVANCE --
For dinner and/or meeting: by email to
or call our CPMT hotline at 1-650-299-8898.
Please reserve for "presentation-only", even if not attending the dinner.
The metallization and interconnect technology used in IC and microelectronic
manufacturing has borrowed extensively from the production processes
developed for electronic components and printed wiring boards. Many of
today's microelectronic plating processes for nickel and gold are the same as
those previously used in other industries. Tin lead electrolytes for wafer
bump have been adapted for application specific equipment. Acid copper
electrolytes for copper Damascene have been modified to suit both the
equipment and the scale of features to be plated. Finally, new formulations
including low alpha lead, gold-tin and nickel-cobalt have been developed for
specific interconnect applications, bonding techniques and MEMS
- Speaker Biography
- William Sepp began his career in field of electroplating 27 years ago
manufacturing automotive and aerospace relays. The next fifteen years
working for a major chemical supplier were spent developing plating
applications for the manufacture of printed wiring boards. Mr. Sepp has been
a senior staff engineer assigned to semiconductor division of Technic Inc.,
Anaheim, CA for the past eight years.
His current activities include; the integration of chemical processes in
automatic manufacturing equipment with emphasis on process monitoring and
control. Development and characterization of lead free finishes for printed
wiring boards and electronic components. Optimization of buried and blind
via technologies for high density interconnects and electroplating methods
and equipment for wafer level metallization and bumping.
If you are not on our Chapter's regular email distribution list
for meeting anouncements, you can easily be added!
Please send an Email to
and let me know if you'd like email or FAX distribution.
If you don't have Email, then please reply to 800 686-9366 (CPMT's 800 number), but
please be advised that I would greatly prefer the Email route.
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