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OVERVIEW:

Temperature measurement of electronics has been the focal point of thermal management whether at the die, component, PCB or system level. The accuracy by which this measurement is done plays a pivotal role in the success of the product in the market place. However, the tools and instruments used to measure temperature vary depending on the packaging level. For example certain tools are only suitable at the die level and at the system level, bulk meters like thermocouples or thermistors are most commonly used. Talks at this meeting will explore remote temperature measurements with presentations from two different sources.

Liquid Crystal Thermography -- An Effective Method for Die, Package and PCB Temperature Measurement: In his presentation, Dr. Azar says that this methodology uses the color response of thermochromic liquid crystals (TLC) for the purpose of temperature measurement. Liquid crystals reflect incident light at the visible wavelength based on the temperature of the surface to which they are applied. When the surface is illuminated by white light and viewed under fixed optical conditions, the TLC material will reflect a unique wavelength distribution of visible light (i.e., color).
As the temperature rises through the TLC's bandwidth, the reflected color of the TLC will change. This phenomenon is selective reflection and occurs in most TLCs both on heating and cooling, and occurs with minimal hysteresis.
Since the process is based on visible wavelength (contrary to IR systems that are in Infra Red bandwidth) temperature measurement is independent of surface emissivity and not confined to 5 micron spatial resolution. With high-resolution optics and a sensitive video camera, temperature measurement of 1 micron size (or less) objects are made possible. Once the TLC temperature response is accurately calibrated, temperature measurements with 0.1 degree C resolution are easily attained.
In this presentation Liquid Crystal Thermography, its principles of operation and a resulting turnkey system are discussed. In addition, LCT is compared with competing technologies and other measurement techniques to highlight its points of strength and weakness as it is used in electronics thermal characterization.

Micro-Bolometer Sensor and Infrared Camera Design: The micro-bolometer sensor made its debut in thermal imaging radiometers in the spring of 1997. The uncooled micro-bolometer focal plane array eliminated the cooling requirement and the micro-bolometer's enhanced dynamic range characteristics also allowed thermographers to operate the camera on much wider temperature spans than cameras that employed cooled technology.
Today's infrared cameras are able to detect a temperature differential of .02 degrees C and detect the temperature of targets as small as 24 microns. These same advancements have reduced both the cost of the cameras and the overall size.

Speaker Biographies

Dr. Kaveh Azar is the president and CEO of Advanced Thermal Solutions, Inc. (ATS). Prior to this new appointment, Dr. Azar was the founder and manager of Lucent Technologies' thermal management center, responsible for developing the next generation of cooling systems. In addition, Dr. Azar has authored Lucent's thermal roadmap and served as the corporate thermal consultant. While at Lucent, he developed a state-of-the-art thermal/fluids laboratory for simulation of components, boards and systems.
Since 1985, Dr. Azar has been an active participant in electronics thermal community and has served as the organizer, general chair and the keynote speaker at national and international conferences sponsored by ASME, IEEE and AIAA. He has also been an invitee to national bodies such as NSF, NIST and NEMI for organizing government and industry research goals in electronics cooling.
Dr. Azar has been an adjunct professor at a number of universities, and lectures worldwide in analytical and experimental methods in electronics cooling. He holds more than 26 national and international patents, has published more than 58 articles, 3 book chapters and a book entitled, "Thermal Measurements in Electronics Cooling." In addition, he serves as the editor-in-chief of Electronics Cooling Magazine, and was awarded IEEE SEMI-THERM's Significant Contributor Award in the thermal management of electronics systems.

James Hungerford is the Northern California district manager for Flir Systems. James has a degree in electrical engineering from San Jose State University. He has worked in the test and measurement field for the last four years.

Brad Risser is a graduate of the United States Military Academy (West Point) with a BS in engineering and has an MBA from Pepperdine University. He is Flir's district sales manager for Southern California, Hawaii, and Nevada and has served in this capacity for the past four years.