IEEE/CPMT Dinner Meeting, in the Santa Clara Valley:
Hey Buddy, Can you Spare a Paradigm?
Wednesday, March 12, 2003
Update on efforts by the
JEDEC JC15.1 Thermal Characterization Subcommittee to develop
standards for simulation and test needed for 21st century technology --
Bruce Guenin, Sun Microsystems
COME EARLY to the Exhibitor Reception, 5:15 - 6:30 PM, to review the
SEMI-THERM exhibits and snack on the munchies and beverages!
Presentation (no cost) at 7:00 PM.
Fairmont Hotel170 South Market St., San Jose -- see Parking
PLEASE RESERVE IN ADVANCE --
For meeting: by email to
Please reserve for "presentation-only", even if not attending the Exhibits and snacks.
The JEDEC JC15.1 Thermal Characterization Subcommittee has established
itself as the world's premiere thermal standards organization for IC
packaging. It is working on a broad agenda in the areas of thermal
testing and simulation. Two specific activity areas are highlighted
below and will comprise the main focus of the presentation. Other
activity areas will be briefly described.
In the simulation area, the focus of effort is on standards and
guidelines relating to the generation and use of what are called
Compact Thermal Models (CTMs). As power levels go up and the
performance margins go down, there is the need for calculating the
temperature of ICs in actual systems. The traditional use of Theta,ja
together with engineering judgment is no longer sufficient. CTMs are,
in essence, resistor networks which can accurately represent heat flow
through the IC package when used in system-level simulation software.
CTM methodologies are still an very active area of research. The
challenge here is to create standards and guidelines which will
provide a structure to allow the effective use of CTMs, even as the
technology moves forward at a rapid pace.
In the test area, the emphasis is on completing the standards work of
the Theta,jc measurement. Theta,jc is the limiting thermal resistance
in determining how much power can be dissipated in an IC when an
external heat sink is used. A key challenge has been to provide
methods for measuring the case temperature accurately, while avoiding
overly complicated or expensive instrumentation. The need for a
robust standard in this area grows yearly as the power levels continue
- Speaker Biography
Dr. Bruce M. Guenin currently holds the position of Principal Research Engineer at the RAS Computer Analysis
Laboratory, Sun Microsystems. He is responsible for initiating, conducting, and leading research related to thermal
management and reliability of high-end servers, using both simulation and testing. Previously he directed thermal
characterization activities at Amkor Technology supporting a wide variety of IC packaging products.
He has authored or co-authored over 30 papers in the areas of thermal and electrical characterization of microelectronic
packages, high-temperature superconductivity, electrical connectors, solid state physics, and fluid dynamics, and holds 5
He is the Chairman of the JEDEC JC-15.1 Committee, which sets industry standards for thermal testing and modeling.
Dr. Guenin was recently General Chair of the 2001 Semi-Therm Conference. Additionally, he is an Associate Editor of
Electronics Cooling Magazine.
Dr. Guenin received the B.S. degree in Physics from Loyola University, New Orleans, and the Ph.D. in Physics from the
University of Virginia.
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