March 17, 2004
Ramada Inn
PLEASE RESERVE IN ADVANCE --
In this talk, we'll examine the technical requirements of substrates and
the
use of interposers as the "impedance translators" from chip-level wiring
densities to those of the substrate. The choices affect signal integrity,
thermal conductance, reliability, and cost.
Education: B.S. in Chemistry from Minnesota, where he graduated with highest honors and was elected to the National Honor Society. He studied his Masters in Business Education at Arizona State University.
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