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Packaging & Board Assembly Technology Trends and Their Impact on the Supply Chain --
Dr. Donkai Shangguan, Director - Advanced Process Technology, Flextronics

April 14, 2004
  • Seated dinner served at 6:30 ($25 if reserved before April 10; $30 after & at door; vegetarian available)
  • Presentation (no cost) at 7:30.

    Ramada Inn

  • 1217 Wildwood Ave (Fwy 101 frontage road, between Lawrence Expressway and Great America Parkway), Sunnyvale, (800) 888-3899 -- see map.


  • For dinner and/or meeting: by email to Allen Earman
  • Please reserve for "presentation-only", even if not attending the dinner.

    This presentation reviews the future trends for packaging and board assembly technology and their impact on the supply chain. Packaging and board assembly technologies are discussed that enable continued miniaturization, functional densification and integration, as well as environmental friendliness, for both small form factor and large form factor electronics products. The development and implementation of these technologies will have specific and direct impact on the supply chain, including packaging, board assembly materials, processes and equipment. Fast time-to-market requirements, in combination with low cost and high reliability needs for different product categories, demand ever increasing cooperation throughout the supply chain, with early visibility.

    Speaker Biography
    Dongkai Shangguan received his BS degree in Mechanical Engineering from Tsinghua University, China, and his Ph.D. degree in Materials from the University of Oxford, U.K., with an MBA degree from San Jose State University. He conducted post-doctoral teaching and research at the University of Cambridge and then at The University of Alabama, and worked for 10 years at Ford/Visteon as Senior Technical Specialist and Supervisor of Advanced Electronics Manufacturing. He is currently Director for Advanced Process Technology at Flextronics. Dongkai has published 1 book and over 100 papers, has given numerous technical presentations, and is currently working on a new book. He has 19 U.S. and international patents issued and a number of U.S. and international patents pending. Dongkai is a senior member of IEEE, and actively participates in professional organizations and consortia, and has chaired technical sessions at numerous conferences. Dongkai has received a number of recognitions for his contributions to the industry, including the "Outstanding Young Manufacturing Engineer Award" from the Society of Manufacturing Engineers (SME), and the most recent "Soldertec Lead-Free Soldering Award of 2002". He is listed in "American Men & Women of Science" and "Who's Who in America". Dongkai can be reached at

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