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OVERVIEW:

Substrates with higher density are being expected, driven by reductions in device size and the increase in pin-counts, and by the growing demand for smaller form-factor packages. In this talk, the latest developments in high density flexible substrates are covered. The comparison between flexible and rigid substrates will be addressed. The discussion will cover the development activities on trace pitch and via/land diameter, semi-additive bussless products, bumped flex, multi-layer build-up substrates and embedded passives, etc, for CSP, BGA, flip chip and 3-D packages for memory, ASIC, optical and RF devices for applications in mobile and telecommunications electronics.

Speaker Biography

Cui Cheng Qiang is Chief Technology Officer for Compass Technology Co. Ltd in Hong Kong. He has over 10 years of experience in microelectronics primarily focusing on materials and reliability in wafer fabrication and IC packaging. He was a Member, Technical Staff and group leader in the advanced packaging development department, Institute of Microelectronics (IME), Singapore from 1995-2000. He worked as a research scientist at National University of Singapore from 1991-1995. Dr. Cui received his Ph.D in Chemistry from the University of Essex, UK in 1991, and M.Eng and B.Eng in electrochemical engineering from Tianjin University in 1985 and 1983. He was the recipient of the prestigious Lee Kuan Yew Fellowship in 1992. He has published over 100 papers in international journals and conferences and holds over 10 patents in the USA and UK.