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OVERVIEW:

Electronics interconnection and packaging continues to grow and evolve to meet the needs of present and future generation electronic products. While long viewed as fundamentally two dimensional, a newly coined, overarching term that captures the essence and intent of the new paradigm is Volumetric System Miniaturization and Interconnection (VSMI). It is apt because over that last few years, the electronics industry has been seriously exploring the 3rd dimension, or volume, in an ongoing attempt to discover new solutions for electronic interconnections capable of directly addressing the challenges that lie ahead. This presentation will review some of the many new three dimensional packaging and interconnection solutions that have been introduced over the last few years and look at some of the solutions currently in development and some potential applications.

Speaker Biography

Joseph Fjelstad, a co-founder of SiliconPipe, has over 30 years of experience in the electronic interconnection industry. He holds nearly 100 US patents and has focused his career primarily on the conception and development of novel electronic interconnection structures and the manufacturing processes required the make them. Joe is the author, co-author or editor of several books on electronic interconnections including "Flexible Circuits for Engineers" and "Flexible Circuit Technology" and numerous technical papers. In addition, he writes two monthly columns: "Flexible Thinking", for Circuitree Magazine and "Small Matters", for Global SMT and Packaging. He is also a member of the JISSO International Committee and the IPC National Electronics Roadmap Committee.