Presentation Slides: Stablcor (460kB PDF)   T-Lam (160kB PDF)   ThermalClad (300kB PDF)

December 8, 2004

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OVERVIEW:

3 materials experts will explain advantages of each company's proprietary substrate constructions. Presenters will discuss Thermal Clad, Thermagon, and Stablcor. Presentations will be followed by a panel to entertain questions.

(Don't miss our Short Course, "Thermal Design and Modeling of IC Packages" on December 15th!)

StablCor Technology
As the electronics industry continues to move in the direction of increased processing power in smaller packages, thermal solutions have become essential. Among many current designs in the market, thermal management issues come into play as high performance components such as ASICs or CPUs create "hot spots" on the Printed Circuit Board. These hot spots result in decreased component life and can, in extreme cases, result in component failure. Stablcor technology can help in reducing junction temperatures by acting as a heat spreader or heat sink. Stablcor technology can also help to increase product reliability by contributing to its ability to tailor CTE, substantially increase the stiffness and give a substantial weight reduction compared to some of the heavy metal solutions like Heavy Copper, Copper-Invar-Copper (CIC), Copper-Moly-Copper (CMC), Thermal Clad and other Metal core technologies. This talk will discuss a cost effective technology -- STABLCOR -- which reduces temperatures of electronic components, provides a CTE range from 2.5 ppm to 12 ppm, and reduces warpage with increased stiffness at no weight premium.

Thermagon Technology
Conventional printed circuit boards heavily populated with heat-generating components present reliability problems and can cause components to exceed maximum temperature limitations. In order to avoid expensive solutions such as adding heat sinks or other active heat removal devices, Thermagon has developed the T-lam system of thermally conductive circuit boards. T-lam consists of a base layer of aluminum or copper metal, and alternating ceramic-filled epoxy (dielectric) and copper layers. Heat is drawn down through the thermally conductive dielectric layer to the metal base, where it is spread and subsequently removed from the system. Typical T-lam circuit board constructions for single and multiplayer requirements are presented, along with properties and performance of the T-lam system.

Thermal Clad Insulated Metal Substrates™
The continuous increase in power of electronic assemblies, coupled with a simultaneous desire to reduce size, results in ever increasing power density requirements. This is an introduction to Bergquist Thermal Clad materials and how they are effective tools in increasing watt density of power assemblies. Some examples of Thermal Clad applications are given in addition to a discussion of materials properties and helpful hints on package design.

Speaker Biographies

Don Roy is one of the founders of ThermalWorks. Currently, Mr. Roy is serving as Executive Vice President of Marketing heading up partnerships, licensing, and sales efforts for the Stablcor line of thermally advantaged PCB technology. Mr. Roy's experience in high performance technologies and mission critical electronics provides broad scope expertise to select and guide Stablcor licensees in what is expected to be a worldwide shift from traditional FR-4 PCB's to Stablcor based PCB's. Prior to his current position, Mr. Roy was President and Chief Operating Officer of Ramtek from 1996 through 2000 where he worked with high performance stacked die to enable high density memory modules.

Kris Vasoya is one of the original founders of ThermalWorks and is credited as the inventor of ThermalWorks signature Stablcor technology. Mr. Vasoya currently serves as ThermalWorks Executive Vice President of Engineering & Technology, overseeing integration with new licensees, product testing, and new product development. Kris Vasoya's vast expertise in material sciences and viable applications has been a primary driver in reducing the development cycle of ThermalWorks revolutionary Stablcor technology as well as speeding up design time on new applications utilizing Stablcor material for critical "time-to-market" product roll-outs. Mr. Vasoya has also authored a series of extensive design guidelines on electronic product designs utilizing Stablcor that are now considered invaluable handbooks by major defense and aeronautics engineering departments from around the world. Prior to his current work with ThermalWorks, Mr. Vasoya served as the Engineering/Project Manager for Seven years at SDC, a printed circuit board manufacturer servicing the military and commercial markets. Kris Vasoya's work leading engineering teams and manufacturing teams has helped provide much of the groundwork for "practical & viable for manufacturing" development. He completed his BS (1994) Degree in Mechanical Engineering at Sardar Patel University, India.

Dr. Richard Hill is presently the Director of Technology for Thermagon, Inc. where he is responsible for the development of new products designed to meet the heat removal needs of the electronics industry. He has wide experience in materials science, with areas of expertise in ceramic powder synthesis, polymers, and thermally conductive polymer-ceramic composites. Dr. Hill is inventor on 14 US Patents, and is author of numerous technical publications. Prior to joining Thermagon, he spent time at the University of New Mexico, Advanced Ceramics Corporation, and Union Carbide. He received his BS and MS degrees from Rutgers University in Ceramic Engineering, and doctorate degree from the University of Leoben, Austria.

Justin Kolbe holds a BS in Chemical Engineering from the University of Minnesota. He is currently a Technology Development Scientist focusing on the development of new materials and processes for power applications requiring thermal management. He has been with the Bergquist Company for 8 years in development, process development and applications support of insulated metal substrates.