IEEE Home Search IEEE Shop Web Account Contact IEEE
Membership Publications/Services Services Standards Conferences Careers/Jobs

"Long Term Trends in Packaging Technology - The International Packaging Roadmap Update" -- Joe Adam, Skyworks Inc.

Presentation Slides: "Long Term Trends in Packaging Technology" (50kB PDF)

Yes, the CPMT Chapter now has a dinner meeting each month (usually on the second Wednesday), PLUS a Lunch Meeting on the fourth Thursday. We hope you like the new format, and the additional presentations we are able to bring to you!

Thursday, January 27, 2005

  • Buffet lunch served from 11:45 - 12:15 ($15 if reserved before January 24; $20 at door; vegetarian available); presentation at 12:15.
    Ramada Inn
  • 1217 Wildwood Ave (Fwy 101 frontage road, between Lawrence Expressway and Great America Parkway), Sunnyvale, (800) 888-3899 -- see map.


  • If you pay using our PayPal link, you are automatically registered for the lunch and meeting
  • Otherwise, for lunch and meeting, pre-register by email to John Jackson, Analog Devices

    Long-term industry trends in packaging and related research needs based on the new 2004 ITRS and NEMI Packaging Roadmaps will be reviewed. This includes key trends on package cost, thermal performance, electrical performance, size, pin count, reliability, and design. The most difficult technical challenges for the industry with emphasis on materials and infrastructure challenges will also be reviewed and the long-term market implications will be discussed. The speaker encourages audience interaction and will provide time for open discussion after the talk.

    Speaker Biography
    Joe Adam is Vice President for Strategic Marketing at Skyworks Inc. where he is responsible for RF product strategy and new business development. His primary area of interest is the evaluation, selection, and implementation of new technologies to maximize product revenue and reduce product cost. Prior to his present position he was the VP of Packaging and Test at Conexant where he was responsible for development leading-edge manufacturing technologies for telecommunications products. He is the Co-chair for the ITRS and NEMI Packaging Roadmap Working Groups.

    If you are not on our Chapter's regular email distribution list for meeting anouncements, you can easily be added! Please send an Email to Paul Wesling and let me know if you'd like email distribution.

    SCV Chapter Home Page
    How to Join IEEE
    Contact our Chapter Chair
    CPMT Society Home Page
    IEEE Home Page
    Email to Webmaster
    Last updated on