IEEE/CPMT Luncheon Meeting, in the Santa Clara Valley:
"Long Term Trends in Packaging Technology - The International Packaging Roadmap Update" -- Joe Adam, Skyworks Inc.
Presentation Slides: "Long Term Trends in Packaging Technology" (50kB PDF)
Yes, the CPMT Chapter now has a dinner meeting each month (usually on the second Wednesday), PLUS a Lunch Meeting on the fourth Thursday. We hope you like the new format, and the additional presentations we are able to bring to you!
Thursday, January 27, 2005 Buffet lunch served from 11:45 - 12:15
($15 if reserved before January 24; $20 at door;
vegetarian available); presentation at 12:15.
1217 Wildwood Ave (Fwy 101 frontage road, between Lawrence Expressway and Great America Parkway), Sunnyvale, (800) 888-3899 -- see map.
PLEASE RESERVE IN ADVANCE --
If you pay using our PayPal link, you are automatically registered for the lunch and meeting
Otherwise, for lunch and meeting, pre-register by email to
John Jackson, Analog Devices
Long-term industry trends in packaging and related research
needs based on the new 2004 ITRS and NEMI Packaging Roadmaps will be
reviewed. This includes key trends on package cost, thermal
performance, electrical performance, size, pin count, reliability, and design. The
most difficult technical challenges for the industry with emphasis on
materials and infrastructure challenges will also be reviewed and the long-term market implications will be discussed. The speaker encourages
audience interaction and will provide time for open discussion after
- Speaker Biography
Joe Adam is Vice President for Strategic Marketing at Skyworks Inc. where he is responsible for RF product strategy and new business development. His primary area of interest is the evaluation, selection, and implementation of new technologies to maximize product revenue and reduce product cost. Prior to his present position he was the VP of Packaging and Test at Conexant where he was responsible for development leading-edge manufacturing technologies for telecommunications products. He is the Co-chair for the ITRS and NEMI Packaging Roadmap Working Groups.
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