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OVERVIEW:

Organic substrate technology is the basic building block for almost all PBGA packages today. How did this technology get started? And what are the future challenges? Organic substrates are essentially small printed circuit boards and have extensively replaced ceramic substrates as chip carriers. The predominant substrate is the plastic ball grid array (PBGA) substrate which was conceived out of the need for surface mountable substrates with a vision for lower substrate cost and better electrical performance. The lower cost advantage over ceramic was based on the form factor used to manufacture printed circuit boards, and its mature industry.

This presentation will outline some of the history in development of PBGA substrates and the corresponding manufacturing challenges that had to be overcome. Lastly, some of the current development needs, also driven by environmental demands, will be highlighted.

Speaker Biography:

Bernd Appelt received his PhD in polymer science at the University Of Mainz, Germany. Subsequently he post-doced at the University of Massachusetts with Roger Porter and at IBM Research with Gus Ouano. He spent many years in IBM Endicott, New York, in various R&D and M.E. positions before joining ASE as Director of Marketing for ASE Materials Substrates.

His work has focused on packaging technologies, developing new materials and processes for printed circuit boards as well as substrates, implementation of water-based process technologies and establishing Teflon-based substrate technologies. He also managed the PWB licensing program within IBM. Bernd has published numerous technical papers and holds many patents.