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"Thinning and Dicing Ultra-thin Wafers" -- Mark Brown, Disco Hi-Tec America

Thursday, March 24, 2005

  • Buffet lunch served from 11:45 - 12:15 ($15 if reserved by March 21; $20 at door; vegetarian available); presentation at 12:15.
    Ramada Inn
  • 1217 Wildwood Ave (Fwy 101 frontage road, between Lawrence Expressway and Great America Parkway), Sunnyvale, (800) 888-3899 -- see map.


  • If you pay using our PayPal link, you are automatically registered for the lunch and meeting
  • Otherwise, for lunch and meeting, pre-register by email to John Jackson, Analog Devices

    As consumers' demands for smaller, lighter, and faster technology become reality, the need for thinner packaging technology is paramount. Advanced thinning and dicing of ultra-thin wafers has enabled packaging designers to maintain similar form factors with increased functionality and capacity. Several specific technological advances in wafer thinning and dicing have led this industry transition. In traditional packaging, dicing always followed backgrinding. However, new processes have reversed this order and placed dicing before grinding. Thus, eliminating wafer level breakage. This presentation will discuss these leading edge technologies and the advantages that they can provide.

    Speaker Biography
    Mark Brown is currently part of the upper management team at Disco Hi-Tec America, headquartered in Santa Clara. Since first working for Disco in 1976, his role has included Engineering, Process, and Sales. His experience over the 30 years has allowed him to directly participate in the complete evolution of wafer thinning and dicing.

    If you are not on our Chapter's regular email distribution list for meeting anouncements, you can easily be added! Please send an Email to Paul Wesling and let me know if you'd like email distribution.

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