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OVERVIEW:

While a significant volume of work has been conducted in the past ten years by the industry on manufacturing issues to enable the gradual conversion to lead-free solders, reliability studies of lead-free solder interconnects are still emerging. The issue of reliability is complicated by the wide variety of application environments and requirements, which give rise to different loading conditions. The physics of failure, which is directly related to reliability, is a critical topic still under intense investigation for lead-free solders. The topic is further complicated by the fact that the relative reliability comparison between eutectic Sn-Pb solder and the lead-free solder alloys varies with the loading conditions. These complications create great difficulties for the development of appropriate acceleration testing profiles and for reliability prediction. This presentation will review the important reliability issues for lead-free solder interconnection systems, including the components, the PCB, and the solder joints, under different loading conditions (thermomechanical, dynamic mechanical, electrochemical, etc).

Speaker Biography:

Dr. Donkai Shangguan received his BS degree in Mechanical Engineering from Tsinghua University, China, Ph.D. degree in Materials from the University of Oxford, U.K., and MBA degree from San Jose State University. He conducted post-doctoral teaching and research at the University of Cambridge and then at the University of Alabama, and lectured at Wayne State University as Adjunct Faculty.

Dongkai worked for 10 years at Ford Motor Co. / Visteon Corporation as Senior Technical Specialist, Supervisor of Advanced Electronics Manufacturing, and Manager of Supplier Quality, before he joined Flextronics International in 2001 where he is currently Director for Advanced Process Technology with the Corporate Technology Group.

Dongkai has published 1 book and over 150 papers (including many journal publications and several book chapters), has given numerous technical presentations and keynotes, and his latest book on lead-free solder interconnect reliability will be published soon. He has 20 U.S. and international patents issued and a number of U.S. and international patents pending. He is currently a regular columnist for the "Global SMT & Packaging" magazine.

Dongkai is a senior member of IEEE and SME, and actively participates in professional organizations and consortia, and has chaired technical sessions and panels at numerous conferences. He has received a number of recognitions for his contributions to industry, including the "Total Excellence in Electronics Manufacturing Award" from the Society of Manufacturing Engineers (SME), and the "Soldertec Lead-Free Soldering Award".