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This luncheon talk will focus on solder reaction, spalling of intermetallic compound in thin under-bump metallization (UBM) and Kirkendall void formation in thick under-bump metallizations.
Two additional topics will be covered in the CPMT Chapter's afternoon Seminar, from 1:30 - 5 PM:
Dr. Tu has been a Science Research Council Senior Research Fellow and The Royal Society Guest Research Fellow at Cavendish Laboratory, UK; Fellow of American Physical Society; Fellow of the Metallurgical Society; Overseas Fellow of Churchill College; Application to Practice Award of the Metallurgical Society; Alexander von Humboldt Research Award for senior US scientists; President of the Materials Research Society in 1981. His research interest is in kinetic processes in thin films, metal-Si interfaces, electromigration, Pb-free solder metallurgy, low dielectric constant thin films, and phase changes driven by high current density and high electric and magnetic fields. In addition to over 300 articles, he has published a book entitled Electronic Thin Film Science.
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