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"Reliability of Lead-free Solder Joints: Intermetallic Reactions"
-- Prof. King-Ning Tu, UCLA

Thursday, July 21, 2005
  • Buffet lunch served from 11:45 - 12:15 ($15 if reserved by July 18; $20 at door; vegetarian available); presentation at 12:15.

    Note: first priority for lunch seating is for registrants in the afternoon seminar, "Reliability of Lead-free Solder Joints: Electromigration and Sn whiskers", also being held at the Ramada. Consider registering for the full afternoon -- then your lunch is included!

    Ramada Inn
  • 1217 Wildwood Ave (Fwy 101 frontage road, between Lawrence Expressway and Great America Parkway), Sunnyvale, (800) 888-3899 -- see map.


  • If you pay using our PayPal link, you are automatically registered for the lunch and meeting
  • Otherwise, for lunch and meeting, pre-register by email to John Jackson, Analog Devices

    Reliability of solder joint technology has been a concern throughout the microelectronics industry -- for example, the low-cycle fatigue induced by thermal stress in flip chips. At present, the risk of fatigue problems has been greatly reduced by the invention of underfills applied between a flip chip and its substrate. On the other hand, due to the recent drive toward Pb-free solders, new reliability issues have emerged, such as Sn whisker growth on Cu leadframes finished with eutectic SnCu or matte Sn. Furthermore, because of the demand of added functions in advanced consumer electronic devices, electromigration is now a serious reliability issue because of the increase of current density in each solder joint.

    This luncheon talk will focus on solder reaction, spalling of intermetallic compound in thin under-bump metallization (UBM) and Kirkendall void formation in thick under-bump metallizations.

    Two additional topics will be covered in the CPMT Chapter's afternoon Seminar, from 1:30 - 5 PM:

  • Electromigration Effects in Solder Joints
  • Sn Whisker nucleation and growth

    Speaker Biography
    Professor K.N. Tu holds a B.S., National Taiwan University; M.S., Brown University; Ph.D. in Applied Physics, Harvard University(1968). He worked at IBM's T.J. Watson Research Center for 25 years, managing their Thin Film Science department and as Senior Manager of the Materials Science Department. For the past 12 years he has been on the faculty of the Materials Science & Engineering department at UCLA, including 5 years as chair of the department.

    Dr. Tu has been a Science Research Council Senior Research Fellow and The Royal Society Guest Research Fellow at Cavendish Laboratory, UK; Fellow of American Physical Society; Fellow of the Metallurgical Society; Overseas Fellow of Churchill College; Application to Practice Award of the Metallurgical Society; Alexander von Humboldt Research Award for senior US scientists; President of the Materials Research Society in 1981. His research interest is in kinetic processes in thin films, metal-Si interfaces, electromigration, Pb-free solder metallurgy, low dielectric constant thin films, and phase changes driven by high current density and high electric and magnetic fields. In addition to over 300 articles, he has published a book entitled Electronic Thin Film Science.

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