IEEE/CPMT Dinner Meeting, in the Santa Clara Valley:
"Imprint Patterning: An Alternative Circuit Fabrication Process"
-- Craig Davidson, Dimensional Imprint Technology, Inc.
Presentation Slides: "Imprint Patterning" (325 kB PDF)
Wednesday, October 12, 2005 Seated dinner served at 6:30
($25 if reserved before Oct. 9; $30 after & at door;
Presentation (no cost) at 7:30.
$25 -- Register & prepay for dinner in one step from your PayPal account or Credit/Debit Card!
Ramada Inn1217 Wildwood Ave (Fwy 101 frontage road, between Lawrence Expressway and Great America Parkway), Sunnyvale, (800) 888-3899 -- see map.
PLEASE RESERVE IN ADVANCE --
For dinner and/or meeting: by email to
Please reserve for "presentation-only", even if not attending the dinner.
A new approach to fabricating printed circuits named Imprint PatterningTM will be described. In conventional printed circuit fabrication two major process elements -- photolithography and laser drilling -- contribute significantly to performance constraints and cost. Imprint Patterning replaces these two steps with a single cost-effective microreplication operation that results in huge cost and performance advantages. These same techniques are used today to fabricate CDs and DVDs with high quality and low cost. And they are on the semiconductor technology roadmap for the sub-40 nm nodes. Dimensional Imprint Technology, Inc. is commercializing Imprint Patterning for the printed circuit industry.
- Speaker Biography:
Dr. Craig Davidson
is Sr. VP and Chief Technology Officer of Dimensional Imprint Technology, Inc. He has expertise in various high technology industries including electronics and aerospace. Dr. Davidson was previously the VP of Technology for Multilayer Technology, Inc. (Multek) the 12th largest PCB supplier in the world and a wholly owned subsidiary of Flextronics International. His career spans printed circuit fabrication, semiconductor packaging, and card-level assembly processes. Dr. Davidson's degrees are in Chemistry and Materials Science. He holds 7 patents and is widely published in the technical literature.
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