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"2005 ITRS Roadmap: Assembly & Packaging"
-- Dr. Bill Bottoms, Third Millennium Test Solutions, Inc

Presentation Slides: "The 2005 ITRS Assembly and Packaging Roadmap" (1.3MB PDF)

Thursday, March 23, 2006

  • Buffet lunch served from 11:45 - 12:15 ($15 if reserved by March 20; $20 at door; vegetarian available); presentation at 12:15.

    Ramada Inn
  • 1217 Wildwood Ave (Fwy 101 frontage road, between Lawrence Expressway and Great America Parkway), Sunnyvale, (800) 888-3899 -- see map.


  • If you pay using our PayPal link, you are automatically registered for the lunch and meeting
  • Otherwise, for lunch and meeting, pre-register by email to John Jackson, Analog Devices
    The latest version of the International Technology Roadmap for Semiconductors (ITRS) was released less than two months ago. Bill Bottoms, Chair of the ITRS Assembly and Packaging Technical Working Group, will talk to us about the directions, challenges and potential solutions as seen from ITRS. He will address the near term assembly & packaging roadmap requirements and discuss new requirements and potential solutions to meet market needs in the longer term. Today assembly and packaging is a limiting factor in both cost and performance for electronic systems. This has resulted in acceleration of innovation. Design concepts, packaging architectures, materials, manufacturing processes and systems integration technologies are all changing rapidly. As traditional Moore's-law scaling becomes more difficult, assembly and packaging innovation allowing scaling in the third dimension is taking up the slack. This accelerated pace of innovation has resulted in development of several new technologies and expansion and acceleration of others introduced in prior years. Wireless and mixed signal devices, bio-chips, optoelectronics and MEMS have placed new requirements on packaging and assembly. The rapid adoption of these new elements in the expanding consumer electronics market has been a strong driver of innovations such as Systems in a Package (SIP), Wafer Level Packaging (WLP) and 3 Dimensional Packaging. Come to listen to the latest output from the ITRS Assembly & Packaging ITWG, and perhaps offer your insight for discussion.

    Bill Bottoms

    Speaker Biography
        W. R.(Bill) Bottoms, Chairman of the Board of Third Millennium Test Solutions, Inc. (3MTS), received his Ph.D in Physics from Tulane University. In 1981, after serving for several years on the faculty of Princeton University, Dr. Bottoms was named the first President of the newly formed Semiconductor Equipment Group of Varian Associates. He resigned from Varian in 1985 to spend full time in the venture capital industry.
        Dr. Bottoms was a General Partner of Patricof & Co. Ventures Inc., a leading international venture capital firm, from 1985 until he joined Credence Systems Corporation as its Chairman and CEO in July of 1996. He has participated in the founding of several companies in the semiconductor industry including Credence Systems Corporation and Tessera. Dr. Bottoms founded Third Millennium Test Solutions in 1999 and currently serves as its Chairman and CEO.
        Dr. Bottoms has been appointed to a number of government committees and was Chairman of the Technical Advisory Committee to the U.S. Export Control Commission for Semiconductor Equipment and Materials. He has served as Chairman of the National Research Council Board on Assessment of NIST Programs; Co-chair of the Sematech Supplier Roundtable for Assembly and Packaging; a member of the International the Technology Roadmap Committee and chairman of its Technical Working Group for Assembly and Packaging, and a member of the Industrial Advisory Board for Lawrence Livermore National Laboratories.
        Dr. Bottoms has served on the Board of Directors of many companies both public and private. He currently is a member of the board of Tulane University and serves on the Boards of several private corporations.

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