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"3-D and Multi-Technology Packaging: Current Capabilities"
-- Phil Marcoux, CORWIL

Presentation Slides: "3-D and Multi-Technology Packaging: Current Capabilities" (700 kB PDF)

Thursday, September 28, 2006

  • Buffet lunch served from 11:45 - 12:15 ($15 if reserved by Sept 25; $20 at door; vegetarian available); presentation at 12:15.

    Ramada Inn
  • 1217 Wildwood Ave (Fwy 101 frontage road, between Lawrence Expressway and Great America Parkway), Sunnyvale, (800) 888-3899 -- see map.


  • If you pay using our PayPal link, you are automatically registered for the lunch and meeting
  • Otherwise, for lunch and meeting, pre-register by email to John Jackson, Analog Devices
    The interest in multi-component (MCP) IC packaging has created several new assembly technologies and demands. The nuances of some of these technologies are well understood for some and emerging daily for others. This presentation will summarize what is known and is still challenging for the key technologies including wafer thinning, dicing before grid, die stacking, new die-attach materials, wire bonding and flip chip. The speaker will cover the common substrate types, the economics, and the design challenges encountered though his company's experiences.

    Speaker Biography
    Phil Marcoux is a Senior Member of the IEEE and past Executive Director of MEPTEC. He's currently the SIP/MCP and Business Development Manager for CORWIL (Milpitas CA). Previously Phil was CEO of two well-known start-ups and Associate Professor at the Graduate School of Engineering, University of Santa Clara.

    If you are not on our Chapter's regular email distribution list for meeting anouncements, you can easily be added! Please send an Email to Paul Wesling and let me know if you'd like email distribution.

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