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OVERVIEW:

Photonics communication advantages of higher bandwidth, lower latency, and lower power consumption predestine photonics to be integrated with electronic integrated circuits. Convergant solutions are challenged by low cost requirements and CMOS compatibility. Cost requirements are 2 to 3 orders of magnitude lower than that of telecom and datacom photonic device configurations. Solutions that integrate photonics functionality with CMOS processing have yet to be widely explored. This presentation will address the challenges for convergence solutions, review state-of-the-art advances and predict future trends.

Speaker Biography:

Dr. Edward Palen, P.E., specializes in creating solutions for the design, prototyping, qualification and manufacturing of optoelectronic and microelectronic devices through his business, PalenSolutions Optoelectronic Packaging Consulting. Services include packaging solutions for lower cost devices, component integration solutions, materials choices, process development, design-for-manufacturability, and generating configurations for integration of photonics with electronics, CMOS processing and assembly processing.

Prior to this Edward was Director of Advanced Process Development at Teledyne Optoelectronics for outsource manufacturing and product development for telecommunications markets. He was a lead materials and process problem solver for Mil-Sat payloads and satellite solar arrays at TRW Space & Electronics Group. At GM Hughes Electronics he was responsible for M&P troubleshooting in the business units of electro-optical data systems, satellites, radar, missiles, HRL and power products. Edward has a Ph.D. in Chemical Engineering from University of California Los Angeles and a B.Sc. in Chem. Eng. from University College London, England. He is based in the San Francisco Bay Area and consults with companies globally.