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"Future IC Packaging Trends -- Finer-Pitch Connection and Heat Extraction" -- John Burke, Senior Manager-Operations, Optichron

Presentation Slides: "Pitch and Power: Packaging Considerations" (1 MB PDF)

Wednesday, November 8, 2006

  • Seated dinner served at 6:30 ($25 if reserved before November 5; $30 after & at door; vegetarian available)

  • Presentation (no cost) at 7:30.

    Ramada Inn

  • 1217 Wildwood Ave (Fwy 101 frontage road, between Lawrence Expressway and Great America Parkway), Sunnyvale, (800) 888-3899 -- see map.


  • For dinner and/or meeting: by email to Janis Karklins
  • Please reserve for "presentation-only", even if not attending the dinner.

    This presentation discusses ideas described in a patent application taken out in 2001 on how to connect a 40-micron-pitch die onto a flexible substrate using flip-chip technology. At the time that this patent was applied for, the speaker was working as a design engineer for flip chip on flex and rationalized that the main barrier to finer-pitch flip chip was not going to necessarily be the bumping pitch on the wafer, but how to connect it to the flex circuit. An innovative method of forming the final trace connections AFTER the chip has been mounted will be described.

    The presentation will also look at issues with heat extraction from various BGA systems -- face up, face down, wire boded and flip chip packaging -- and look at a proposed new method that will enable superior heat extraction from the die area of the package.

    Speaker Biography:
    John Burke founded the UK-based Surface Mounted and Related Technologies (SMART) Group in 1984, and has worked in the area of advanced manufacturing for many years. He has taught at various universities on technology, including university of Dundee, University of Hull, University of Limerick and University of Cambridge. John worked on the generation of IPC 1752 as a part of the 2-18 committees, and dealt with reporting standards for hazardous materials. John is currently employed by Optichron Inc., a fabless semiconductor vendor based out of Fremont, as the Senior Operations Manager. He has spoken at many events in Europe and the US, is English and has a somewhat dry sense of humor.

    If you are not on our Chapter's regular email distribution list for meeting anouncements, you can easily be added! Please send an Email to Paul Wesling and let me know you'd like email distribution.

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