NOTE: This lunch is INCLUDED in the fee for the half-day short course, "Challenges in Preassembly: Thin Silicon Dice and Developments in Chip Separation". Please see the course description.
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Dice before Grind (DBG) promises to be a reliable method to singulate highly thinned and fragile dies. DBG works by reversing the backgrind-to-dicing process flow and instead the wafer is ground after dicing. This brings a paradigm change. Superior strengths on ultrathin chips in mass production have been achieved. The presentation will focus on the many challenges of transferring thin silicon chips in high-volume production.
From 1990 to 1995 he was with Rodenstock Precision Optics, Munich, developing optical systems as a member of the technology group and managing projects in the industrial optics devision. Since 1995 he has been working at Infineon Technologies, Regensburg. He worked as a senior process engineer for several front-end fields like CVD, epitaxy and tungsten. From 1997 to 2003 he was the responsible manager for preassembly. Today he is working for the corporate group responsible for new developments in wafer-finishing for logic devices as principal preassembly manager. He holds several patents and has numerous international publications.
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