IEEE/CPMT Dinner Meeting, in the Santa Clara Valley:
"uPILR MicroContacts: A Next-Generation Chip-Scale Packaging Solution"
-- Belgacem Haba, Ph.D., Tessera, Inc.
Wednesday, June 13, 2007
Seated dinner served at 6:30
($25 if reserved by June 10; $30 after & at door;
Presentation (no cost) at 7:30.
$25 -- Register & prepay for dinner in one step from your PayPal account or Credit/Debit Card!
Ramada Inn1217 Wildwood Ave (Fwy 101 frontage road, between Lawrence Expressway and Great America Parkway), Sunnyvale, (800) 888-3899 -- see map.
PLEASE RESERVE IN ADVANCE --
For dinner and/or meeting: by email to
Please reserve for "presentation-only", even if not attending the dinner.
Hand-held communication and entertainment products will continue to dominate the consumer markets worldwide and, with each generation offering more and more features and/or capability, system level integration and miniaturization becomes more of a priority. And even though the actual applications and functionality of the new product offering expands, the customer is expecting each generation to be smaller and lighter that its predecessor. A number of single-die and stacked-die package innovations have been developed for this broad market but many supplier companies are not meeting acceptable manufacturing yields and the difficulty of simultaneous testing of multiple mixed-die technology is not always practical. Without implementing more innovative package methods, the functional capability of the newer generation of hand-held and portable products may never reach expectation or achieve manufacturing cost objectives.
The challenge manufactures face when competing in the world marketplace is to offer a product that will meet all performance and functionality expectations without increasing product size or cost. Increased electronic functionality can be achieved through the development of more complex silicon integration but that route generally requires a great deal of capital resources and an excessive amount of time. Multiple-die package concepts are often proving superior to the system-on-chip alternative because it minimizes risk and has the potential for economically integrating several different but complementary functions. The information presented in this paper will review several package-on-package configurations and introduce a new packaging technology. A non-solder ball package, called "MicroContact", is based on a new substrate fabrication process developed to improve IC package density and circuit routing efficiency. In addition, the basic MicroContact package assembly methodology will be described and examples of high density stacked memory and mixed function variations shown. We will discuss the MicroContact effect on pitch, socketless testing, low profile, and reliability especially on lead free drop test.
- Speaker Biography:
Dr. Bel Haba joined Tessera as a Fellow in October 2002 and became CTO of Advanced Packaging and Interconnect in April 2006. He is responsible for overseeing next-generation research and development activities for Tessera, Inc. Dr. Haba is also a founder of SiliconPipe Inc., a high-speed interconnect start-up company based in Silicon Valley. Prior to that, he managed the packaging research and development division at Rambus. From 1991 to 1996, he managed advanced research and development projects at the NEC Central Research Laboratories in Japan and, prior to that, worked for IBM at its T.J. Watson Research Center in New York. During his tenure at NEC and IBM, Dr. Haba's activities included the applications of lasers in the field of microelectronics.
Dr. Haba received his bachelor's degree in solid state physics from the University of Bab-Ezouar, Algeria in 1980. He holds two master's degrees in applied physics, materials science and engineering from Stanford University, where he also earned a Ph.D. in materials science and engineering in 1988. Dr. Haba holds 85 U.S. patents, and over 130 worldwide patents and patent applications. He has authored numerous technical publications and has also participated in many conferences worldwide
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