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"An Alternative Method for Manufacturing Robust Electronic Assemblies Without Solder" -- Joseph (Joe) Fjelstad, President, Verdant Electronics

Wednesday, November 14, 2007
  • Seated dinner served at 6:30 ($25 if reserved by Nov. 11; $30 after & at door; vegetarian available)

  • Presentation (no cost) at 7:30.

    Ramada Inn

  • 1217 Wildwood Ave (Fwy 101 frontage road, between Lawrence Expressway and Great America Parkway), Sunnyvale, (800) 888-3899 -- see map.


  • For dinner and/or meeting: by email to Janis Karklins
  • Please reserve for "presentation-only", even if not attending the dinner.

    The electronics industry has assembled electronic components to printed circuit boards for more than 50 years. That relationship has been an enduring one, however with the transition from traditional tin-lead solder to new lead-free solders mandated by European legislation, the industry is being saddled with significant new expenses and plagued with problems not previously encountered. In this environment, an improved approach to electronics assembly without the use of solder is being developed. The process is being called the Occam Process in honor of the 14th century philosopher and logician, William of Occam, who stressed simplicity. The presentation will describe the process, its advantages, its challenges and its future and technology roadmap. The talk will include a review of the developers' conference that will have been held a few weeks earlier in the month of October.

    Speaker Biography:
    Joseph (Joe) Fjelstad is founder and president of Verdant Electronics. He has more than 35 years of international experience in electronic interconnection and packaging technology in a variety of capacities from chemist to process engineer and from international consultant to CEO. Mr. Fjelstad is also a well known author and magazine columnist writing on the subject of electronic interconnection technologies. Prior to founding Verdant, Mr. Fjelstad co-founded SiliconPipe, a leader in the development of high speed interconnection technologies. He was also formerly with Tessera Technologies, a global leader in chip-scale packaging, where he was appointed to the first corporate fellowship for his packaging innovations.

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