$25 -- Register & prepay for dinner in one step from your PayPal account or Credit/Debit Card!

Ramada Inn

PLEASE RESERVE IN ADVANCE --

OVERVIEW:

We address the role and attributes of, as well as the state-of-the art and major findings in, the field of analytical thermal stress modeling in electronic and photonic engineering. The emphasis is on simple and practical models that can be and have been used in the physical design and reliability evaluations of electronic and photonic assemblies, structures and packages.

We indicate the role, attributes, merits and shortcomings of analytical thermal stress modeling, and its interaction with numerical (primarily finite-element) and experimental techniques. The topics addressed include Timoshenko's bi-metal thermostat theory and its extension; thermally matched assemblies and assemblies bonded at the ends; design recommendations; thin film structures; polymeric materials and plastic packages of IC devices; photonic (primarily fiber optic) structures; and application of probabilistic approaches. Thermal stress modeling in nano-materials and nano-structures is also briefly discussed.

A review "Analytical Thermal Stress Modeling in Electronic and Photonic Systems" is available upon request. It will be published later on this year in the ASME Applied Mechanics Reviews.

Speaker Biography:

Dr. Ephraim Suhir is a Fellow of the IEEE, the American Physical Society (APS), the American Society of Mechanical Engineers (ASME), the Institute of Physics (IoP), UK, and the Society of Plastics Engineers (SPE). He has formed, and is chairing, the IEEE TAB NTDC Group on Portable Information Devices (PIDs), and the IEEE Vehicular Technology Society (VTS) Technical Committee on PIDs, and is co-founder of the ASME Journal of Electronic Packaging and served as its Technical Editor (Editor-in-Chief) for eight years (1993-2001). Ephraim holds 20 US patents and has authored about 300 technical publications (papers, book chapters, books). He is currently a BoG Member and Distinguished Lecturer of the IEEE CPMT Society and is Associate Editor of the IEEE CPMT Transactions on Advanced Packaging. He has organized many successful conferences and symposia in the USA, Europe and Asia countries, and presented numerous keynote and invited talks worldwide.

Some major awards: 2004 ASME Worcester Read Warner Medal for outstanding contributions to the permanent literature of engineering through a series of papers in Mechanical, Microelectronic, and Optoelectronic Engineering, which established a new discipline known as the Structural Analysis of Microelectronic and Photonic Systems; 2001 IMAPS John A. Wagnon Technical Achievement Award for outstanding contributions to the technical knowledge of the microelectronics, optoelectronics, and packaging industry; 2000 IEEE-CPMT Outstanding Sustained Technical Contribution Award for outstanding, sustained and continuing contributions to the technologies in fields encompassed by the CPMT Society; 2000 SPE International Engineering/Technology (Fred O. Conley) Award for outstanding pioneering and continuing contributions to plastics engineering; 1999 ASME and Pi-Tau-Sigma Charles Russ Richards Memorial Award for outstanding contributions to mechanical engineering, and 1996 Bell Laboratories Distinguished Member of Technical Staff Award for developing extremely accurate and robust engineering mechanics methods for predicting the reliability, performance, and mechanical behavior of complex structures used in manufacturing Lucent Technologies products.