IEEE Home Search IEEE Shop Web Account Contact IEEE
Membership Publications/Services Services Standards Conferences Careers/Jobs

    "Thermal Management for the Design of Telecom and Server Systems"
    -- Marlin Vogel, Electronic Cooling Solutions and
    "Standard Semiconductor Thermal Measurements – Implementation & Practical Aspects"
    -- Bernie Siegal, President, Thermal Engineering Associates

Thursday, May 27, 2010
  • Registration, free pizza and soft drinks at 11:30 AM; Presentation at 12:00 Noon; Tour at 12:30 PM.
        (Vogel) A systematic approach will be provided for architecting and determining the feasibility of a system thermal design, along with presenting the necessary process steps required to validate and finalize a reliable system design. The approach includes combining “back-of-the-envelope” calculations with computational fluid dynamic (CFD) analysis to identify a preliminary system design; identify critical areas for long lead thermal component design, if applicable, such as heat pipe heat sinks or air movers; define thermal component and system testing in order to determine boundary conditions required by the CFD analysis for updating the system design, along with validating preliminary and final versions of the thermal design. The role and impact of the thermal architect and design process on the overall system architecture and design will be presented. Wind tunnel test methods will be demonstrated for validating the system airflow performance, along with validating air mover performance.
        (Siegal) A procedure for JEDEC standard thermal measurements of semiconductor devices will be presented with a focus on the practical aspects of the measurements. Although the presentation will concentrate on integrated circuit thermal measurements, the procedure described is applicable to most semiconductor devices in almost any package. The presentation will include a discussion of alternative temperature calibration methods, thermal test environments, measurement results, and data interpretation. Specific thermal measurement environments discussed will include natural convection (still air) (ThetaJA), forced convection (ThetaJMA), board reference (ThetaJB), and cold plate (ThetaJC). The difference between thermal resistance (Theta) and thermal metric results will be discussed and examples given.
        The facility tour will also include demonstrating CFD analysis prediction of airflow results for a system, depicting the steady state airflow trajectory path through the system.

    Speaker Biography:
        Marlin Vogel has over 25 years of experience in thermal management of electronic and aerospace products. He holds 11 patents and has authored or co-authored over 20 technical papers and publications. Before joining ECS, Marlin held a position as a Senior Staff Engineer at Sun Microsystems, where he worked on a wide variety of projects during the last 18 years. Prior to working at Sun, Marlin held a position as Engineering Specialist while at the General Dynamics military aircraft division for 7 years, 2 years as a Research Assistant at University of Wisconsin, and 2 years as an Engineer at Ipsen Industries. Marlin has a Masters of Science Degree in Mechanical Engineering from the University of Wisconsin - Milwaukee.
        Bernie Siegal's first involvement in semiconductor thermal matters came in 1966 while working at Hewlett-Packard Associates (HPA), the HP microwave semiconductor group. In 1974, Bernie founded SAGE Enterprises, Inc. and offered test equipment for measurement of semiconductor device thermal resistance. The thermal testing techniques Bernie developed eventually became incorporated into many of the industry (SEMI and EIA/JEDEC) and US military measurement (Mil Std 750) standards. Bernie was co-founder and primary force behind the start of SEMI-THERM. He has authored over 40 technical papers, presented seminars to world-wide audiences, and conducted several short courses for the Univ. of California, Berkeley, Extension Program. He founded THERMAL ENGINEERING ASSOCIATES, INC. (TEA) in 1997 to maintain his involvement in the field. Bernie holds M.B.A. (Santa Clara University), M.S.E.E. (San Jose State University), and B.E.E. (Cornell University) degrees. He was elected a Life Fellow of the IEEE and received the IEEE Significant Contributor Award for his work in the semiconductor thermal field. He currently serves on the Executive Committee for the IEEE CPMT Silicon Valley Chapter and is Chairman of the Steering Committee for SEMI-THERM (Semiconductor Thermal Measurement, Modeling and Management) Symposium.

    If you are not on our Chapter's regular email distribution list for meeting anouncements, you can easily be added! Place yourself on our email distribution list or send a request to Paul Wesling.]

    SCV Chapter Home Page
    How to Join IEEE
    Contact our Chapter Chair
    CPMT Society Home Page
    IEEE Home Page
    Email to Webmaster
    Last updated on