IEEE Santa Clara Valley CPMT Society Chapter

"New Drivers and Strategies for Multi-Die Packaging" -- Farshad Ghahghahi, Manager of Package Design, LSI Corporation

• Buffet dinner served at 6:00 PM ($20 if reserved by June 11) ; $10 for fulltime students and currently unemployed engineers; $5 more at the door; vegetarian available)

• Presentation (no cost) at 6:45 PM (arrive by 6:35 PM)

  Please register in advance for this event, using our IEEE Council's DoubleKnot registration site.

  You may register yourself, plus others from your company/institution, for both dinner and presentation, or for only the presentation. You may make an on-line payment for the dinner, or arrange to pay at the door.

PLEASE RESERVE IN ADVANCE --
• For dinner and/or meeting: at the Doubleknot link above.
• Even if you're coming only for the presentation, we want you to sign up on our registration web site, so we can quicken the sign-in process and get everyone seated by 6:45 PM.
Biltmore Hotel

• 2151 Laurelwood Rd (Fwy 101 at Montague Expressway), Santa Clara, (408) 346-4620 -- click map at right.

  
  

  OVERVIEW:

      Several forces are driving a resurgence of interest in Multi-Die Packaging. While foundries hit increasing NRE, product cost and technical barriers, the Packaging Community has produced a plethora of Multi-Die solutions including Stacked Die, PoP (Package on Package),PIP (Package in Package), 2.5D, and 3D, and seen increasing use of MCM's (Multi Chip Modules) using prepackaged memory chips. More exotic solutions are emerging such as Embedded Die, Glass Interposers and Wafer Level Fan Out.
      While these solutions, or combinations of these solutions, offer significant advances in latency, bandwidth, power and form-factor, they face significant hurdles of supply chain and KGD (Known Good Die) issues and will ultimately be judged by the cold, unforgiving eye of the accountant.
      The presentation will consider these drivers and strategies from a High End Custom solution perspective.

  

  Speaker Biography:
  

      Farshad Ghahghahi graduated from Southwest Minnesota State University in 1982 with a Bachelors degree in Mechanical Engineering. He worked at Tandem Computers in development of component and system packaging for 14 years. Farshad has spent the last 15 years at LSI Corporation in Milpitas, in various Engineering and Management positions in Package Design. Farshad is currently Manager of Package Design at LSI Corporation. he holds 17 US patents related to component package design, and has presented papers in the area of Package Co-Design and new Developments.

  
  

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