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    "New Wafer-Level Embedded Package Structure and Technology using Large-Scale Panel Assembly"
    -- Akio Katsumata, General Manager, Packaging Research & Development Center, J-Devices Corporation

Presentation Slides: "New Embedded Package Technology using Large-Scale Panel Assembly (FO-WLP)" Akio Katsumata, J-Devices Corporation (900 kB PDF)

Thursday, February 21, 2013

  • Registration at 11:30 AM; Buffet lunch served from 11:45 - 12:15 ($15 if reserved by February 19; $5 for fulltime students and currently unemployed; $5 more at door; vegetarian available; presentation (no cost) at 12:15.
        This presentation describes a new embedded package structure and technology for the next generation of WLP, the Wafer level Fan-Out Package - WFOPTM. A face-down mounting style, the WFOP has a metal stainless steel or copper plate as a basis for the redistribution interconnection layer. The redistributed layer is fabricated with a semi-additive copper plating method. The contact between the die pads and distribution layer is the lead-finger type.

        With this structure we reduce fabrication costs by using large-scale panels and precise redistribution interconnect controls, and the design rules do not depend on the die size. Moreover, WFOP has several benefits:

  • applicable to 50um pad pitch;
  • excellent thermal characteristics contributed by the metal plate; and
  • noise shielding afforded by the metal plate.
    Reliability testing has been completed.

        In this presentation, we describe the WFOP package structure, process flow, package characteristics and reliability test results and discussion.

    Speaker Biography:
        Akio Katsumata is the General Manager for the Packaging Research & Development Center at J-Devices Corporation. He previously spent 23 years at Toshiba Corporation as a development researcher on semiconductor package design and new package development after graduating from Chiba University in Japan. He holds 13 US Patents granted and 4 US Patents filed. He joined J-Devices Corporation in 2009.

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