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    Packaging: The Core of Competitive Advantage
    -- Bill Chen, Fellow of ASE Group, & Past President of the CPMT Society

Presentation Slides: "Packaging: The Core of Competitive Advantage" Bill Chen, Fellow of ASE Group (1.7 MB PDF)

Thursday, March 28, 2013

  • Registration at 11:30 AM; Buffet lunch served from 11:45 - 12:15 ($15 if reserved by March 26; $5 for fulltime students and currently unemployed; $5 more at door; vegetarian available; presentation (no cost) at 12:15.
        Since the invention of transistors in 1947, and the invention of integrated circuits in 1958, the semiconductor and electronics industries have been at the core of global productivity and economic growth. From mainframe computers to PC, and from PC to smart phones and tablets, there have been many disruptive changes in electronics market drivers, as well as major shifts in technology direction, business creation, and business consolidation. Electronic packaging is a global business, encompassing dynamic technologies and multi-faceted professional communities. As a global business, it comprises the front end of the electronic product industry and the backend of the semiconductor industry. Its technologies span design, manufacturing and assembly process, test, materials, and equipment.
        Today's consumers have the dominant market share of electronics products. Mobility is a way of life. Packaging at the backend has become a dynamic force for innovation and invention responding the market requirements for diverse functionality, form factor, cost, and time to market. Packaging is, indeed, playing an integral role and through the development of sophisticated technologies and processes, is becoming the important enabler to competitive advantage within an increasingly dynamic electronics market.
        We shall take some examples from Cu wirebond, flip chip and wafer level packaging to illustrate the dynamic evolution of our technologies. The drive for heterogeneous integration has led to the flowering of packaging innovations including TSV (2.5D & 3D), embedded technologies, and new materials and equipment in our ecosystem. Looking to the future, electronic products are being designed on a highly customized basis for individuals, groups, and populations, whose taste, lifestyle, and spending power vary significantly, one to another. And, clearly, our packaging profession and packaging technologies are a mainstay at the core of competitive advantage.

    Speaker Biography:
        William Chen (Bill) is a Fellow of ASE, where he currently holds the position of Senior Technical Advisor at ASE (U.S.) Inc. Prior to joining the ASE Group, Bill was Director of the Institute of Materials Research & Engineering (IMRE), located in the National University of Singapore. Previously, Bill worked for over thirty three years performing various R&D and management positions at IBM Corporation, where he was elected to the IBM Academy of Technology. He is currently the co-chair of the International Technology Roadmap for Semiconductors (ITRS) Assembly and Packaging International Technical Working Group. Bill has been an associate editor of the IEEE/CPMT transactions, and the ASME Journal of Electronic Packaging, and has published extensively in the fields of microelectronics packaging and mechanics of materials. He held the position of President of the IEEE Components, Packaging and Manufacturing Technology Society (CPMT) from 2006-2009. Bill has been elected a Fellow of IEEE and a Fellow of ASME. In 2011, he was awarded the University Medal from Binghamton University
        Bill has held adjunct faculty appointments at Cornell University, Binghamton University, University of Washington, and a visiting faculty appointment at Hong Kong University of Science of Technology. He received his B.Sc. at University of London, M.Sc at Brown University and PhD at Cornell University.

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