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    A Comparison of Low-Cost Interposer Technologies
    -- Terry Kang, Sr. Packaging Development Manager, Nvidia

Presentation Slides: "A Comparison of Low-Cost Interposer Technologies" (1.3 MB PDF)

Thursday, May 23, 2013

  • Registration at 11:30 AM; Buffet lunch served from 11:45 - 12:15 ($15 if reserved by May 24; $5 for fulltime students and currently unemployed; $5 more at door; vegetarian available; presentation (no cost) at 12:15.
        The 2.5D through-silicon-via interposer is the key enabling technology for integrating multi-functional dies to achieve higher electrical performance and smaller package form factors. One of the key challenges for high-volume production is high cost. This presentation introduces and compares the pros and cons of low-cost interposer technologies including thin silicon, organic and glass interposers for "Logic (AP or GPU) + Memory" 3D integration.

    Speaker Biography:
        Terry Kang has over 20 years of experience in package R&D and manufacturing. He is currently Senior Packaging Development Manager at Nvidia with responsibility for Si interposer development for high-volume production. Prior to joining Nvidia, he worked as Sr. Director of the 3D/flip chip development group at Tessera. In 2006 he was Senior Technical member of staff at Altera for large die FC package development for new product implementation. He has published over 27 technical papers and holds 35 U.S. Patents.

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