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    Wafer Level Packaging: A Foundry Perspective
    -- Michael Shillinger, Founder, Innovative Micro Technology

Thursday, June 27, 2013
  • Registration at 11:30 AM; Buffet lunch served from 11:45 - 12:15 ($15 if reserved by June 25; $5 for fulltime students and currently unemployed; $5 more at door; vegetarian available; presentation (no cost) at 12:15.
    OVERVIEW:
        Wafer Level Packaging (WLP) and customized electrical I/O schemes have become mature technology platforms within the MEMS industry. The needs for these technologies were dictated by the sensitive nature of MEMS devices in the ambient environment. This presentation will discuss design, process and testing considerations of both WLP and electrical I/Os.

    Speaker Biography:
    Michael Shillinger has 25+ years of operations management experience, including high-volume wafer manufacturing. Previously Mr. Shillinger was the VP of Operations at Applied Magnetics Corporation, managing multiple wafer fabs and personnel for volume production of 6" wafers, operating 24 hours a day, 7 days a week. He has also held the position of VP of Process Engineering and Assembly Technology. Michael received his Masters in Mechanical Engineering from Case Western Reserve University in Cleveland Ohio.

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