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    Directions in Device Packaging for Mobile Applications
    -- E. Jan Vardaman, President, TechSearch International, Inc.

Presentation Slides: "Directions in Device Packaging for Mobile Applications" (450 kB PDF)

Thursday, March 27, 2014

  • Registration at 11:30 AM; Buffet lunch served from 11:45 - 12:15 ($15 if reserved by March 25; $5 for fulltime students and currently unemployed; $5 more at door; vegetarian available; presentation (no cost) at 12:15.
        Mobile Devices are driving the unit volume growth in semiconductor packaging today. Growth in wafer-level packages (WLPs) continues to be driven by the strong preference for small form factor, low profile packages. A variety of pin counts and die sizes are also found in watches, MP3 players, digital cameras, laptops and tablets. Emerging areas such as wearable electronics will require low-cost and small form factor packages. Fan-out WLPs (FO-WLPs) are receiving increased interest for more than just single-die packages and are emerging as a new potential format for System-in-Package (SiP). This presentation examines application trends for packages, trends in pin count, die size, and ball pitch, and discusses the challenges for today's package designer.

    Speaker Biography:
        E. Jan Vardaman is president and founder of TechSearch International, Inc., which has provided licensing and consulting services in semiconductor packaging since 1987. She is the editor of Surface Mount Technology: Recent Japanese Developments, co-author of How to Make IC Packages (published in Japanese by Nikkan Kogyo Shinbun), a columnist with Circuits Assembly Magazine, and the author of numerous publications on emerging trends in semiconductor packaging and assembly.
        Jan served on the NSF-sponsored World Technology Evaluation Center study team involved in investigating electronics manufacturing in Asia and on the U.S. mission to study manufacturing in China. She is a member of IEEE-CPMT, IMAPS, SMTA, and SEMI. She was elected to two terms on the IEEE CPMT Board of Governors. She received her B.A. in Economics and Business from Mercer University in Macon, Georgia in 1979 and her M.A. in Economics from the University of Texas at Austin in 1981. Before founding TechSearch International, she served on the corporate staff of Microelectronics and Computer Technology Corporation (MCC), the electronics industry's first pre-competitive research consortium.

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