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    The Evolution of Laser Singulation
    -- Devin Martin, Manager of Technology Development, Disco Hi-Tec America

Thursday, April 24, 2014
  • Registration at 11:30 AM; Buffet lunch served from 11:45 - 12:15
  • $15 if reserved by April 22nd; $5 for fulltime students and currently unemployed; $5 more at door; vegetarian available; presentation (no cost) at 12:15.
    OVERVIEW:
        The drive to improve yield and quality while reducing the manufacturing cost of ICs, MEMS, and LEDs has led to the development of several new laser-based singulation methods. Stealth Dicing has proven to be advantageous for many LED and MEMS devices while laser grooving has become a necessity for ICs at 45nm and below. This presentation will cover several recent advances in laser dicing and grooving.

    Speaker Biography:
        Devin Martin received his B.A. from the University of San Francisco. He has held several positions over 17 years at Disco in the US and Japan and is currently the Manager of Technology Development.

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